ST to pull out of IBM Alliance for process technology
January 29, 2015
STMicroelectronics is pulling out of the IBM Alliance for semiconductor process technology and is now, apparently, without a source of core CMOS technology.
“Our agreement with IBM provides us the right to end the participation in this Alliance under certain conditions,” says Jean-Marc Chery, COO of ST, “and we made the decision during the quarter to exercise those rights. Today, we are in discussion with IBM to plan for a smooth wind-down of our participation in this Alliance.”
To read the full article, click here
Related Semiconductor IP
- NPU IP
- JPEG XL Encoder
- I2C Master/Slave Controller Core
- NVMe Validation Test Suite
- Hybrid Memory Cube Verification IP
Related Blogs
- The Future of Storage: From eMMC to the Blazing Speeds of UFS 5.0
- From DIY To Advanced NoC Solutions: The Future Of MCU Design
- Rambus CryptoManager Root of Trust Solutions Tailor Security Capabilities to Specific Customer Needs with New Three-Tier Architecture
- Half of the Compute Shipped to Top Hyperscalers in 2025 will be Arm-based
Latest Blogs
- Tape-Out Readiness Checklist: Engineering Decisions That Prevent Costly Respins
- How Cadence DSPs Put In-Cabin AI Audio On-Chip in SemiDrive's X10
- The Fastest Path to Scalable Photonic Systems: Using Proven IP for both PIC and EIC designs
- Building Trusted AI Agents from the Silicon Root of Trust
- Heterogeneous Computing in Space