Semiconductor Enabled Mobile Internet
January 4, 2010
The mobile internet market will be the single biggest semiconductor innovation driver in the coming decade. The technology required to continually integrate electronic devices into a single handset is daunting. The amounts of information that will need to be retrieved, processed, stored, and displayed will be catastrophic. Reference the Morgan Stanley Mobile Internet Report.
Related Semiconductor IP
- TSMC 7nm 0V75 / 0V9 ESD Local Clamp – Low Cap
- TSMC 65nm 3V3 ESD Local Clamp – Rad Hard
- TSMC 5nm 1V8, 1.2V and 0.9V ESD Local Protection – Low Cap
- TSMC 3nm 3V3 ESD Local Clamp
- TSMC 3nm 1V2 ESD Local Clamp – Low Capacitance
Related Blogs
- The Future of Mobile Devices and the Semiconductor Landscape!
- High Resolution Displays for Mobile, TV, PC and Automotive Enabled by DSC 1.2 in HDMI 2.1
- GlobalFoundries and the Mobile World Congress
- Mobile 2Drive Semi 4Ever!
Latest Blogs
- Beyond Trusted: What the NSA’s New Guidance Means for Hardware Security
- A scalable, shader-programmable vector graphics GPU core for low-power MCUs
- Navigating ISO 26262 Part 11: A Guide for Semiconductor Architects
- Embedded Security explained: Digital signatures
- Hardware security verification must go beyond functional testing