Linley: Mobile Peaked in 2013?
April 28, 2015
Last week was the Linley Mobile Conference. Mobile is a huge semiconductor market and, outside of Intel, is the main driver for next generation process technologies. A new generation of mobile phones comes along, fills the leading edge fabs for a year or two and then moves on to the next generation. Nothing comes close to requiring so many wafers and requiring such a steep ramp.
To read the full article, click here
Related Semiconductor IP
- Mesochronous Bridge for PCIe/CXL
- AI-native GPU
- OpenGMSL Verification IP
- OpenGMSL Leaf IP
- FlexGen Multi-Die Smart Network-on-Chip (NoC) IP
Related Blogs
- Linley Tech Mobile Conference
- And the 2013 Mobile Winner is ... Micron?
- Semiconductor Enabled Mobile Internet
- GlobalFoundries and the Mobile World Congress
Latest Blogs
- Automated, Faster Specification to Sign-Off with IDS-AI
- NovaTech Automation Crius PIU: Bringing Conventional Instrument Transformers onto the IEC 61850 Process Bus
- Single Pair Ethernet and TSN: The In-Robot Network Behind the Next Humanoid Robots
- A design path to success exists for ultra-low-voltage SoCs
- Where Routine Flow Ends Veriest Formal Expertise Begins