Linley: Mobile Peaked in 2013?
Last week was the Linley Mobile Conference. Mobile is a huge semiconductor market and, outside of Intel, is the main driver for next generation process technologies. A new generation of mobile phones comes along, fills the leading edge fabs for a year or two and then moves on to the next generation. Nothing comes close to requiring so many wafers and requiring such a steep ramp.
To read the full article, click here
Related Semiconductor IP
- Band-Gap Voltage Reference with dual 2µA Current Source - X-FAB XT018
- 250nA-88μA Current Reference - X-FAB XT018-0.18μm BCD-on-SOI CMOS
- UCIe D2D Adapter & PHY Integrated IP
- Low Dropout (LDO) Regulator
- 16-Bit xSPI PSRAM PHY
Related Blogs
- Linley Tech Mobile Conference
- And the 2013 Mobile Winner is ... Micron?
- Semiconductor Enabled Mobile Internet
- GlobalFoundries and the Mobile World Congress
Latest Blogs
- AI in Design Verification: Where It Works and Where It Doesn’t
- PCIe 7.0 fundamentals: Baseline ordering rules
- Ensuring reliability in Advanced IC design
- A Closer Look at proteanTecs Health and Performance Management Solutions Portfolio
- Enabling Memory Choice for Modern AI Systems: Tenstorrent and Rambus Deliver Flexible, Power-Efficient Solutions