Linley: Mobile Peaked in 2013?
Last week was the Linley Mobile Conference. Mobile is a huge semiconductor market and, outside of Intel, is the main driver for next generation process technologies. A new generation of mobile phones comes along, fills the leading edge fabs for a year or two and then moves on to the next generation. Nothing comes close to requiring so many wafers and requiring such a steep ramp.
To read the full article, click here
Related Semiconductor IP
- Zigbee Transceiver PHY
- Data Flow Architecture IP
- AMBA SPI Controller MRAM Controller
- Ethernet MAC
- Protocol Bridges
Related Blogs
- Linley Tech Mobile Conference
- And the 2013 Mobile Winner is ... Micron?
- Semiconductor Enabled Mobile Internet
- GlobalFoundries and the Mobile World Congress
Latest Blogs
- IDS-NoC: A Scalable Interconnect Solution for Modern SoC Design
- Leading-edge AI IC designs demand comprehensive HAV methodologies
- Beyond the Fab: Building Europe’s Next Generation of Semiconductor Champions
- AI Semiconductor Design at 3nm and 2nm: Silicon-Proven IP
- Samsung Foundry and Cadence Expand Infrastructure and Physical AI Solution