Intel 450mm Delayed Until 2023
Last week I attended the SPIE Advanced Technology Conference. There were a lot of interesting papers and as is always the case at these conferences, there was a lot of interesting things to learn from talking to other attendees on the conference floor.
The first interesting information from the conference floor was that 450mm is being pushed out. What I heard is that with low fab utilization and the empty fab 42 shell, Intel has pulled all of their resources off of 450mm. Intel was one of the key players pushing 450mm and the comments I heard were 450mm won’t be this decade with 2023 as the new introduction date for high volume manufacturing. Some equipment companies appear to be putting 450mm equipment development on hold.
To read the full article, click here
Related Semiconductor IP
- NoC Interconnect IP Generator
- Over-Voltage Lockout (OVLO) IP
- Verification IP for Universal Chiplet Interconnect Express (UCIe) up to 3.0
- UCIe-S (Gen2) Compatible PHY for Standard Package (x16) in TSMC N3P, North/South Orientation
- DSP-Based 112G SerDes
Related Blogs
- Intel 14nm Delayed?
- Intel Really is Delaying 14nm Move-in. 450mm is Slipping Too. EUV, who knows?
- The State of 450mm Wafers. And Intel Gossip
- Yes, Intel 14nm Really is Delayed...And They Lost $600M on Mobile
Latest Blogs
- Building the engine behind Arm’s silicon shift
- M31 High-Speed and Long-Channel MIPI C/D-PHY Solution on TSMC N3P/N3C
- Understanding security certification and how analog IP can help
- Embedded Security explained: Secure boot for embedded systems
- World's First Standards-Compliant 112G PHY IP for Linear Optics: A Turning Point for AI Interconnects