IEDM 2017 - Intel Versus GLOBALFOUNDRIES at the Leading Edge
As I have discussed in previous blogs, IEDM is one of the premier conferences to learn about the latest developments in semiconductor technology.
On Wednesday December 6th, the Circuit and Device Interaction - Advanced Platform Technologies session was held, and Intel presented their 10nm technology and GLOBALFOUNDRIES (GF) presented their 7nm technology. Despite the different node names, the two processes have similar density. In this article I will combine previous disclosures, interviews and the papers to present a detailed comparison of these two leading edge technologies.
To read the full article, click here
Related Semiconductor IP
- Chiplet Die-to-Die Interconnect IP Solution
- High speed MACsec Engine 100G/200G/400G/800G/1.6T
- Temperature/Voltage sensors
- AMBA Bus Host to eSPI Controller/Target
- AMBA Bus Host to eSPI Controller
Related Blogs
- UMC versus GLOBALFOUNDRIES
- Redefining the Foundry Model: TSMC versus GlobalFoundries
- TSMC versus GlobalFoundries: Semiconductor Design Enablement!
- GlobalFoundries Versus Samsung!
Latest Blogs
- Cadence Achieves Successful Silicon Validation of 1st IP Test Chips on Intel 18A
- From Classical CAN and CAN FD to CAN XL: Functional Safety and Security for Next-Generation In-Vehicle Communication
- Accelerating Embedded Memory Performance with 16-bit xSPI PSRAM IP
- Why nonce reuse can break AES-GCM security in embedded systems
- PQSecure™-Agility Earns NIST CAVP Validation