IEDM 2017 - Intel Versus GLOBALFOUNDRIES at the Leading Edge
As I have discussed in previous blogs, IEDM is one of the premier conferences to learn about the latest developments in semiconductor technology.
On Wednesday December 6th, the Circuit and Device Interaction - Advanced Platform Technologies session was held, and Intel presented their 10nm technology and GLOBALFOUNDRIES (GF) presented their 7nm technology. Despite the different node names, the two processes have similar density. In this article I will combine previous disclosures, interviews and the papers to present a detailed comparison of these two leading edge technologies.
To read the full article, click here
Related Semiconductor IP
- Zigbee Transceiver PHY
- Data Flow Architecture IP
- AMBA SPI Controller MRAM Controller
- Ethernet MAC
- Protocol Bridges
Related Blogs
- UMC versus GLOBALFOUNDRIES
- Redefining the Foundry Model: TSMC versus GlobalFoundries
- TSMC versus GlobalFoundries: Semiconductor Design Enablement!
- GlobalFoundries Versus Samsung!
Latest Blogs
- IDS-NoC: A Scalable Interconnect Solution for Modern SoC Design
- Leading-edge AI IC designs demand comprehensive HAV methodologies
- Beyond the Fab: Building Europe’s Next Generation of Semiconductor Champions
- AI Semiconductor Design at 3nm and 2nm: Silicon-Proven IP
- Samsung Foundry and Cadence Expand Infrastructure and Physical AI Solution