TSMC versus GlobalFoundries: Semiconductor Design Enablement!
August 9, 2010
As mentioned in previous blogs, design enablement is a key enabler to fabless semiconductor design and manufacture, without question. The purpose of this blog (in 500 words) is to compare and contrast two very different design enablement strategies and engage the semiconductor community in a meaningful discussion.
The GlobalFoundry strategy is straight forward so let’s start there. GFI is partnering with leading design enablement companies to advance semiconductor design at the 28nm node. GFI is committed to becoming the FIRST SOURCE for 28nm, competing directly with TSMC, while other foundries have in the past offered “T” like processes for 2nd and 3rd source manufacturing strategies (UMC, Chartered Semi, SMIC).
Related Semiconductor IP
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- TSMC 3nm 3V3 ESD Local Clamp
- TSMC 3nm 1V2 ESD Local Clamp – Low Capacitance
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- How to Obtain ASIC Full Turnkey Services from TSMC and GLOBALFOUNDRIES?
- TSMC (Lincoln) vs Samsung (Clinton) vs Intel (Washington)
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