GlobalFoundries enabling the next wave of "foundry" innovation
According to Mojy Chian, Senior Vice President, Design Enablement, GlobalFoundries, continued innovation in the foundry business demands a new approach. He was speaking at the recently held International Electronics Forum (IEF) 2010 organized by Future Horizons in Dresden, Germany.
GlobalFoundries is bringing a highly integrated model to foundry, which involves the extension of customer operations, early customer-foundry engagement, as well as close collaboration and joint technology development. This would enable faster time to volume and market, leading to smooth ramps to mature yields. Chian added that design, manufacturing, and EDA/IP solutions must work in unison to accomplish this.
According to him, the industry desperately needs a new approach. Here, he discussed GlobalFoundries’ 28nm collaborative innovation, which involves four phases.
To read the full article, click here
Related Semiconductor IP
- Band-Gap Voltage Reference with dual 2µA Current Source - X-FAB XT018
- 250nA-88μA Current Reference - X-FAB XT018-0.18μm BCD-on-SOI CMOS
- UCIe D2D Adapter & PHY Integrated IP
- Low Dropout (LDO) Regulator
- 16-Bit xSPI PSRAM PHY
Related Blogs
- UMC versus GLOBALFOUNDRIES
- TSMC leads 2009 foundry rankings; GlobalFoundries top challenger!
- The GlobalFoundries Enigma
- GlobalFoundries and the Mobile World Congress
Latest Blogs
- AI in Design Verification: Where It Works and Where It Doesn’t
- PCIe 7.0 fundamentals: Baseline ordering rules
- Ensuring reliability in Advanced IC design
- A Closer Look at proteanTecs Health and Performance Management Solutions Portfolio
- Enabling Memory Choice for Modern AI Systems: Tenstorrent and Rambus Deliver Flexible, Power-Efficient Solutions