Finfet's Struggles Boost Simpler, Cheaper FD-SOI
April 30, 2014
FD-SOI, seeking to grow its ecosystem, will get a boost from the remarks of KLA Tencor CEO, Rick Wallace, about the struggles his customers are having with finfets.
“In logic and foundry, with the introduction of the new 3-D gate architectures, the yield issues our customers are grappling with today are proving to be the most challenging that the industry have ever faced, and even the smallest variation and process margin can cause significant yield losses for these devices,’ says Wallace.
FD-SOI uses few masks and has less processing steps than finfet.
To read the full article, click here
Related Semiconductor IP
- 1.6T Ultra Ethernet Controller
- Chiplet Die-to-Die Interconnect IP Solution
- High speed MACsec Engine 100G/200G/400G/800G/1.6T
- Temperature/Voltage sensors
- AMBA Bus Host to eSPI Controller/Target
Related Blogs
- FinFET vs FDSOI - Which is the Right One for Your Design?
- FD-SOI vs FinFET: Dan Hutcheson Re-Runs His Survey
- Altera vs Xilinx FinFET Update
- TSMC vs Intel vs Samsung FinFETs
Latest Blogs
- Embedded Security explained: Advanced Encryption Standard (AES)
- Cadence Demonstrates PCIe 8.0 PHY at PCI-SIG DevCon 2026
- Cadence Achieves Successful Silicon Validation of 1st IP Test Chips on Intel 18A
- From Classical CAN and CAN FD to CAN XL: Functional Safety and Security for Next-Generation In-Vehicle Communication
- Accelerating Embedded Memory Performance with 16-bit xSPI PSRAM IP