Cadence at CES 2015: The IP Story
LAS VEGAS—The annual International Consumer Electronics Show (CES) here is not just about amazing new technologies, although that's what captures the public's attention. It's about the electronics design ecosystem that enables those products.
The Cadence meeting suite may traditionally be tucked away from the crowds near the back of South Hall 2, but it's no less a hive of activity involving members of the IP Group and partners and customers.
Martin Lund, senior vice president for Cadence's IP Group, took some time to talk during CES about what he saw on the show floor and in the bustling Cadence booth, where, he argued, some of the more amazing demos could be seen:
Related Semiconductor IP
- 1.6T Ultra Ethernet Controller
- Chiplet Die-to-Die Interconnect IP Solution
- High speed MACsec Engine 100G/200G/400G/800G/1.6T
- Temperature/Voltage sensors
- AMBA Bus Host to eSPI Controller/Target
Related Blogs
- Designing the AI Factories: Unlocking Innovation with Intelligent IP
- The Next-Generation UCIe IP Subsystem for Advanced Package Designs
- Cadence at CES 2015: Experience Integrated Solutions for Mobile
- Show report: CES 2015
Latest Blogs
- Embedded Security explained: Advanced Encryption Standard (AES)
- Cadence Demonstrates PCIe 8.0 PHY at PCI-SIG DevCon 2026
- Cadence Achieves Successful Silicon Validation of 1st IP Test Chips on Intel 18A
- From Classical CAN and CAN FD to CAN XL: Functional Safety and Security for Next-Generation In-Vehicle Communication
- Accelerating Embedded Memory Performance with 16-bit xSPI PSRAM IP