Altera and Micron help propel HMC, but will 3D packaging limit interest?
Altera Corp and Micron Technology Inc demonstrated a big step forward for Hybrid Memory Cube, by showing a Stratix V interface to the promising 3D technology. How might packaging limit HMC's popularity compared to special-purpose nonvolatiles like ferroelectric or magnetoresistive RAM?
In early August, we talked about the growing importance of memory and system-bus interfaces on next-generation FPGAs. Altera and Micron, both members of the HMC Consortium, are hoping to accelerate the viability and hence the utility of hybrid cubes by making them a mainstream alternative to DRAM and SRAM. Altera not only showed a Stratix V prototype, but indicated it would work on HMC for its upcoming Gen 10 family of FPGAs.
To read the full article, click here
Related Semiconductor IP
- DSP-Based 112G SerDes
- XTAL oscillator in TSMC-7nm
- GPU
- V-by-One Verification IP
- AI model compression IP
Related Blogs
- PLD Overview: Xilinx and Altera
- Xilinx ARMs FPGAs, Altera to MIPSify Them
- Is Altera Looking At Programmable DSP?
- Semiconductor Design in 3D!
Latest Blogs
- World's First Standards-Compliant 112G PHY IP for Linear Optics: A Turning Point for AI Interconnects
- One Key for Every Door: How Aliro Extends the UWB Digital Key Beyond the Car
- Reprogrammable Post-Quantum Security for SoCs: Why Crypto-Agility Matters
- Designing the Beam Steering Core for a C-Band AESA: A Look at VSI's VBF0644 GaAs Beamformer IC
- Secure Boot for embedded systems: Building a complete chain of trust