450mm May Never Happen, says Micron CEO
February 11, 2014
450mm may never happen, according to Mark Durcan, CEO of Micron, the world’s fourth largest semiconductor company.
“I am not convinced that 450mm will ever happen but, to the extent that it does, it’s a long way out in the future,” says Durcan, “there is not a lot of necessity for Micron, at least over the next five years, to be spending a lot of money on 450mm. There is a lot of investment that needs to go on in the equipment community to make that happen. And the value at the end of the day – so that customers would buy that equipment – I think is dubious.”
To read the full article, click here
Related Semiconductor IP
- NoC Interconnect IP Generator
- Over-Voltage Lockout (OVLO) IP
- Verification IP for Universal Chiplet Interconnect Express (UCIe) up to 3.0
- UCIe-S (Gen2) Compatible PHY for Standard Package (x16) in TSMC N3P, North/South Orientation
- DSP-Based 112G SerDes
Related Blogs
- What's happening on the 450mm wafer front?
- How Much Cost Reduction Will 450mm Wafers Provide
- Why do we need 450mm wafers?
- The State of 450mm Wafers. And Intel Gossip
Latest Blogs
- Building the engine behind Arm’s silicon shift
- M31 High-Speed and Long-Channel MIPI C/D-PHY Solution on TSMC N3P/N3C
- Understanding security certification and how analog IP can help
- Embedded Security explained: Secure boot for embedded systems
- World's First Standards-Compliant 112G PHY IP for Linear Optics: A Turning Point for AI Interconnects