Why do we need 450mm wafers?
This is a question often asked by journalists and others not directly involved in 450mm technology, and indeed was one of the questions that formed the basis of the SMART 2010/062 report Future Horizons produced for the European Commission.
It is also a question every new 450mm project has to answer in its funding request to the European Commission, and whilst working on the Bridge450 submission we realised the arguments have become rather unclear over time. The following gives some insight and clarity into the question.
To read the full article, click here
Related Semiconductor IP
- DSP-Based 112G SerDes
- XTAL oscillator in TSMC-7nm
- GPU
- V-by-One Verification IP
- AI model compression IP
Related Blogs
- Do we need a new FPGA structure for prototyping?
- IP integration: what standards do we need?
- Do We Need Fab?
- Why the HMAC did we do this?
Latest Blogs
- World's First Standards-Compliant 112G PHY IP for Linear Optics: A Turning Point for AI Interconnects
- One Key for Every Door: How Aliro Extends the UWB Digital Key Beyond the Car
- Reprogrammable Post-Quantum Security for SoCs: Why Crypto-Agility Matters
- Designing the Beam Steering Core for a C-Band AESA: A Look at VSI's VBF0644 GaAs Beamformer IC
- Secure Boot for embedded systems: Building a complete chain of trust