HiSilicon Expands Cadence Palladium XP Platform Usage For Mobile and Digital Media SoC and ASIC Development
SAN JOSE, Calif., 12 May 2014 -- Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced that HiSilicon further expanded usage of the Cadence® Palladium® XP Verification Computing Platform as its emulation solution for mobile and digital media System-on-Chip (SoC) and ASIC development.
HiSilicon provides ASICs and SoCs for communication network and digital media, including solutions for network surveillance, videophones, Digital Video Broadcast and IPTV. Solutions for these markets require a high level of quality, with robust hardware-software verification, and a quick turn-around time to meet aggressive time-to-market needs.
“We expanded our usage of the Palladium XP platform due to its performance, flexibility, hardware and software co-development efficiency and ability to shorten the time to market for our designs,” said Yanqiu Diao, deputy GM, Turing Processor Business Unit at HiSilicon. “The power verification and analysis capabilities of Palladium XP are also a good match for our increasing number of low power mobile designs.”
Part of the Cadence System Development Suite, the Palladium XP platform is the industry’s first high-performance, special-purpose verification computing platform that unifies best-in-class simulation acceleration and emulation capabilities in a single environment. For more information on the Palladium XP platform, visit www.cadence.com/news/pxp.
About Cadence
Cadence enables global electronic design innovation and plays an essential role in the creation of today’s integrated circuits and electronics. Customers use Cadence software, hardware, IP, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry. More information about the company, its products, and services is available here.
Related Semiconductor IP
- DeWarp IP
- 6-bit, 12 GSPS Flash ADC - GlobalFoundries 22nm
- LunaNet AFS LDPC Encoder and Decoder IP Core
- ReRAM NVM in DB HiTek 130nm BCD
- UFS 5.0 Host Controller IP
Related News
- Cadence Palladium XP Enables QLogic to Rapidly Develop Sophisticated Network Switch
- Cadence Palladium XP Verification Computing Platform Speeds Deployment of Panasonic Systems-on-Chip for Digital Consumer Products
- Ricoh Selects Cadence Palladium XP Platform for Next-Generation Multifunction Printer SoC Development
- Cadence Palladium XP Platform Chosen by Mellanox Technologies to Shorten Development Time of Interconnect Products
Latest News
- Hardware Root of Trust Essential for AI Chip Integrity
- AI Compute Demand Drives 44% YoY Growth for Top 10 Global Fabless IC Firms in 2025
- IBM Announces Strategic Collaboration with Arm to Shape the Future of Enterprise Computing
- Rambus Unveils HBM4E Controller: 16 GT/s, 2,048-Bit Interface, Enabling C-HBM4E
- AimFuture, a Leader in Home Appliance NPUs, to Integrate Mesacure Company’s AI Algorithms