Ricoh Selects Cadence Palladium XP Platform for Next-Generation Multifunction Printer SoC Development
Cadence Technology Achieves 40X Acceleration Speed-Up
SAN JOSE, Calif. -- 15 Jul 2013 -- Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced that Ricoh Corporation selected the Cadence® Palladium® XP verification computing platform for its multifunction printer system-on-chip (SoC) development, after an extensive competitive benchmarking process. Achieving the fastest design âbring-upâ compared to alternative solutions, the Palladium XP platform with Cadence PCIe 2.0 Accelerated Verification IP (VIP) also delivered a 40X verification speed-up over RTL logic simulation.
âWe chose the Palladium XP platform based on its superior technology, better value over alternative solutions and excellent technical support team,â said Mr. Koichi Kamon, deputy division director of the Work Solutions Development Division at Ricoh. âThe simulation acceleration bring-up time with the Palladium XP platform is by far the fastest and easiest in the industry, making it an easy choice for the SoC development of our state-of-the-art multifunction printer products.â
âRicoh is an important new Palladium XP customer for Cadence, and we are collaborating with its design team on the development and verification of their next-generation SoC,â said Nimish Modi, senior vice president, System and Software Realization Group at Cadence. âAs the leader in system verification, Cadence is providing innovative solutions such as the simulation acceleration hot-swap technology between Palladium XP and Incisive® Enterprise Simulator tools as part of an integrated flow for users needing higher performance and productivity.â
Part of the Cadence System Development Suite, the Palladium XP platform is the industryâs first high-performance, special-purpose verification computing platform that unifies best-in-class simulation acceleration and emulation capabilities in a single environment. With its hot-swap technology, the Palladium XP platform delivers unparalleled productivity as users can transition among simulation, simulation acceleration, and emulation environments at runtime without re-compilation. The Palladium XP platform offers systems and semiconductor companies flexible new use models that accelerate verification and hardware-software integration, helping to assure on-time delivery of high-quality products to the market.
About Cadence
Cadence enables global electronic design innovation and plays an essential role in the creation of todayâs integrated circuits and electronics. Customers use Cadence software, hardware, IP, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry. More information about the company, its products, and services is available at www.cadence.com.
Related Semiconductor IP
- Ultra Ethernet MAC & PCS 100G/200G/400G/800G
- Ethernet PCS 100G/200G/400G/800G/1.6T
- Ethernet MAC 100G/200G/400G/800G/1.6T
- Junction Over-Temperature Detector with Linear Centigrade-to-Voltage Output - X-FAB XT018
- Performance P570 Gen 3
Related News
- Cadence Palladium XP Enables QLogic to Rapidly Develop Sophisticated Network Switch
- Cadence Palladium XP Verification Computing Platform Speeds Deployment of Panasonic Systems-on-Chip for Digital Consumer Products
- Cadence Palladium XP Platform Chosen by Mellanox Technologies to Shorten Development Time of Interconnect Products
- Cadence Launches Palladium XP II Verification Platform and Enhanced System Development Suite
Latest News
- SkyeChip Berhad Delivers 35.0% Net Profit Growth Ahead of Main Market Debut on 20 May 2026
- Quantum eMotion and JMEM TEK Sign Consortium Agreement to Accelerate Quantum-Resilient Semiconductor SoC Development
- Silvaco Announces Immediate Availability of Mixel MIPI C-PHY/D-PHY Combo IP on TSMC N2P Process
- BrainChip Strikes IP Licensing Deal with ASICLAND
- Arteris Technology Adopted by Li Auto for Intelligent Vehicles