Faraday Unveils Advanced Packaging Coordinated Platform for Multi-source Chiplets
Hsinchu, Taiwan -- September 10, 2024 -- Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today introduced its advanced packaging coordinated platform for the vertical disintegration of chiplets. This unique platform streamlines the advanced packaging processes by integrating multiple vendors and multi-source chiplets and provides three core advanced packaging services - design, packaging, and production.
In today’s chiplet era, the advanced packaging capacity is increasingly limited. Faraday’s new platform addresses this challenge by effectively coordinating the vertically disintegrated vendors of chiplet, HBM, interposer, and 2.5D/3D packaging and offering chiplets design, testing analysis, production planning, outsourcing procurement, inventory management, as well as 2.5D/3D advanced packaging services. This platform provides a comprehensive one-stop solution with flexible services and business models tailored to the varied needs of clients. It ensures a consistent supply of critical components, including interposers and HBM, reflecting Faraday’s commitment to reliability, long-term supply, and business continuity.
In addition, Faraday excels in designing and implementing major chiplets, including I/O dies, SoC/Compute dies, and interposers. By partnering with UMC, Samsung, Intel, and various OSAT providers, Faraday delivers advanced packaging solutions containing system-level design, power and signal integrity analysis, and thermal dissipation optimization to support Intel’s EMIB, Samsung’s I-Cube, and 2.5D packaging in OSAT.
“Our new platform offers significant benefits to the industry,” said Flash Lin, COO of Faraday. “By leveraging our neutral position and delivering a comprehensive suite of services, we are well-positioned to drive innovation and improve project success in advanced packaging, ensuring superior results for our clients.”
About Faraday Technology Corporation
Faraday Technology Corporation (TWSE: 3035) is dedicated to the mission of benefiting humanity and upholding sustainable values in every IC it handles. The company offers a comprehensive range of ASIC solutions, including total 3DIC packaging, Neoverse CSS design, FPGA-Go-ASIC, and design implementation services. Furthermore, its extensive silicon IP portfolio encompasses a wide array of offerings, such as I/O, Cell Library, Memory Compiler, ARM-compliant CPUs, LPDDR4/4X, DDR4/3, MIPI D-PHY, V-by-One, USB 3.1/2.0, 10/100/Giga Ethernet, SATA3/2, PCIe Gen4/3, and SerDes. For further information, visit https://www.faraday-tech.com.
Related Semiconductor IP
- 1.8V/3.3V I/O library with ODIO and 5V HPD in TSMC 16nm
- 1.8V/3.3V I/O Library with ODIO and 5V HPD in TSMC 12nm
- 1.8V to 5V GPIO, 1.8V to 5V Analog in TSMC 180nm BCD
- 1.8V/3.3V GPIO Library with HDMI, Aanlog & LVDS Cells in TSMC 22nm
- Specialed 20V Analog I/O in TSMC 55nm
Related News
- Faraday Adds Video Interface IP to Support All Advanced Planar Nodes on UMC Platform
- Cadence Collaborates with GUC on AI, HPC and Networking in Advanced Packaging Technologies
- Faraday's Launched SerDes Advanced Service to Accelerate ASICs into Production
- Faraday Unveils 2.5D/3D Advanced Package Service for Chiplets
Latest News
- Will RISC-V reduce auto MCU’s future risk?
- Frontgrade Gaisler Launches New GRAIN Line and Wins SNSA Contract to Commercialize First Energy-Efficient Neuromorphic AI for Space Applications
- Continuous-Variable Quantum Key Distribution (CV-QKD) system demonstration
- Latest intoPIX JPEG XS Codec Powers FOR-A’s FA-1616 for Efficient IP Production at NAB 2025
- VeriSilicon Launches ISP9000: The Next-Generation AI-Embedded ISP for Intelligent Vision Applications