Reflex CES Demonstrates SoC FPGA-Based System-on-Module at Embedded World 2013; Highlights Prototyping Platform, Recorders, Customizable Rugged Systems
2013-02-20 08:18:00
Other
Chiplet News Archive - Page 881 of 1938
Five IC Suppliers to Hold One-Third of 300mm Wafer Capacity in 2013
2013-02-20 08:12:00
Commentary / Analysis
Rambus Updates First Quarter Revenue Guidance
2013-02-20 08:03:00
Financial
Rambus and LSI Corporation Sign Patent License Agreement
2013-02-20 08:02:00
Deals
GLOBALFOUNDRIES Offers Enhanced 55nm CMOS Logic Process with ARM Next-Generation Memory and Logic IP Support for Low Voltage
2013-02-20 07:39:00
Foundries
Tensilica to Demonstrate Fujitsu Smartphone that Uses Multiple Tensilica DPUs Including ConnX BBE DSP and HiFi Audio/Voice at Mobile World Congress in Barcelona
2013-02-20 01:04:00
Other
ARM and STMicroelectronics Join with Mathworks to Enable Code Generation, Debug and Modelling For STM32 Microcontrollers
2013-02-19 16:41:00
Embedded Systems
Tilera Announces TILE-Gx72, the World's Highest-Performance and Highest-Efficiency Manycore Processor
2013-02-19 16:21:00
Chip
LSI Introduces Axxia 5500 Communication Processors with ARM Technology for High-Performance, Power-Efficient Networks
2013-02-19 16:00:00
Chip
Kilopass Receives Frost & Sullivan Award for Non-Volatile Memory Innovator
2013-02-19 14:10:00
Other
CEVA and Mindspeed Extend Relationship to Address LTE-Advanced Small Cells
2013-02-19 13:13:00
Deals
CEVA Introduces MUST Multi-core System Technology, Adds Vector Floating-point Capabilities for CEVA-XC DSP Architecture Framework
2013-02-19 12:08:00
IP
CAST Adds Multicast and AXI to UDP/IP Core for Streaming Media Systems
2013-02-19 11:34:00
IP
AnSem announces the availability of an Analog Front End that makes Power Line Communication for smart grids more reliable
2013-02-19 09:50:00
Chip
New mimoOn Library for Tensilica's Baseband DSP IP Cores Speeds Up LTE and LTE-Advanced Chip Designs
2013-02-19 07:33:00
Embedded Systems
Sensory's New TrulyHandsfree 3.0 Speaker Verification and Speaker Identification Optimized Port Available on Tensilica HiFi Audio/Voice DSPs
2013-02-19 07:27:00
Embedded Systems
CEVA and Sensory Partner to Deliver Lowest Power Voice Activation Solution Based on CEVA-TeakLite-4 DSP Platform
2013-02-19 06:17:00
Embedded Systems
Lantiq Introduces Lowest Power GPON SoC Solution for SFP Optical Module Form Factor
2013-02-19 01:34:00
Chip
Mentor Graphics Nucleus Innovate Program Adds NXP Semiconductors and Expands Device Support
2013-02-18 15:48:00
Embedded Systems
S3 Group Launches 10 new Silicon Proven IP Cores
2013-02-18 15:31:00
IP