Spreadtrum Announces Commercial Launch of Dual-Core Smartphone Chipsets for TD-SCDMA and EDGE 2013-04-04 09:21:00 SoC Architecture & Assembly
Worldwide Semiconductor Revenue Declined 2.6 Percent in 2012, According to Final Results by Gartner 2013-04-03 14:02:00 Analysis & Insight
Xilinx Vivado Design Suite Accelerates Time to Integration and System-Level Design to Stay a Generation Ahead 2013-04-03 13:41:00 SoC Architecture & Assembly
Hybrid Memory Cube Consortium Heralds 2013 as Turning Point for High-Performance Memory ICs, Gains Rapid Consensus for Final Specification and Decision to Renew Consortium 2013-04-03 03:52:00 Misc
Accellera Systems Initiative Launches Working Group to Standardize Interoperability of Multiple Language Verification Environments and Components 2013-04-03 01:57:00 EDA & Design Tools
GLOBALFOUNDRIES Demonstrates 3D TSV Capabilities on 20nm Technology 2013-04-02 15:26:00 Foundries & Process Nodes
DI2CMS, I2C Master - Slave Bus Interface from Digital Core Design 2013-04-02 14:38:00 IP Cores & Design
ARM and TSMC Tape-Out First ARM Cortex-A57 Processor on TSMC's 16nm FinFET Technology 2013-04-02 14:14:00 IP Cores & Design
Altis Semiconductor Introduces the Next Generation of Embedded CBRAM Technology 2013-04-02 08:31:00 Foundries & Process Nodes
Global Semiconductor Sales Remain Ahead of 2012 Pace in February 2013-04-02 07:23:00 Analysis & Insight
Ittiam unveils a full HD low latency streaming solution with a glass-to-glass latency of less than 70ms 2013-04-02 03:35:00 SoC Architecture & Assembly
Imagination Technologies announces Caustic ray-tracing hardware certification on Lenovo workstations 2013-04-02 01:22:00 SoC Architecture & Assembly
Sidense 1T-OTP NVM Qualified for 150 Degrees C Automotive High-Reliability Requirements on TSMC's BCD Process 2013-04-01 16:08:00 IP Cores & Design