Lenovo to design own chips
Junko Yoshida, EETimes
3/29/2013 1:20 PM EDT
BEIJING, China– Lenovo, the second largest smartphone supplier in China, will get into the chip design business with a special focus on smartphones and tablets, EE Times has learned.
The company, which has maintained a small IC design team consisting of about 10 people over the last decade, is now committed to expanding this team to about 100 engineers by the middle of this year, according to a China-based industry source with direct knowledge of Lenovo’s recruitment of chip designers.
Related Semiconductor IP
- Multi-channel Ultra Ethernet TSS Transform Engine
- Configurable CPU tailored precisely to your needs
- Ultra high-performance low-power ADC
- HiFi iQ DSP
- CXL 4 Verification IP
Related News
- Imec coordinates EU Chips Design Platform
- Presto Engineering Group Acquires Garfield Microelectronics Ltd, Creating Europe’s Most Comprehensive ASIC Design to Production One-Stop-Shop
- NVIDIA and Synopsys Announce Strategic Partnership to Revolutionize Engineering and Design
- HCLTech partners with Dolphin Semiconductor to develop energy-efficient chips for IoT and data center applications
Latest News
- proteanTecs and Gubo Technologies Collaborate to Deliver Unified Analytics Solution for Advanced Semiconductor Systems
- Cadence Completes Acquisition of Hexagon’s Design and Engineering Business, Advancing Leadership in Physical AI and Multiphysics
- TES Launches its µEngine: Parallel CPU System for Deterministic Real-Time HDL Applications
- PQShield becomes ST Authorized Partner
- sensiBel Licenses Sofics’ Advanced ESD Solutions for their Studio-quality MEMS Microphone Technology