Fujitsu Semiconductor ASIC Design for 2G/3G/4G Baseband Processor in Volume Production with Synopsys 28-nm MIPI M-PHY 2013-04-09 20:12:00 Commercial Deals
SEMI Reports 2012 Global Semiconductor Materials Sales of $47.1 Billion 2013-04-09 06:51:00 Analysis & Insight
Cadence and TSMC Strengthen Collaboration on Design Infrastructure for 16nm FinFET Process Technology 2013-04-08 15:20:00 EDA & Design Tools
Altera Demonstrates Industry's First 32-Gbps Transceiver with Leading-Edge 20 nm Device 2013-04-08 15:13:00 SoC Architecture & Assembly
Xilinx and its Ecosystem Showcase All Programmable and Smarter Vision Systems at NAB 2013 2013-04-08 15:09:00 SoC Architecture & Assembly
Xilinx Enables OEMs to Develop Smarter Broadcast Solutions With Availability of its Real-Time Video Engine 2.1 2013-04-08 15:06:00 SoC Architecture & Assembly
Barco Silex FPGA design speeds transactions in award-winning Atos Worldline Hardware Security Module (HSM) 2013-04-08 13:56:00 Commercial Deals
intoPIX Launches New Ultra Compact JPEG2000 FPGA IP-cores at NAB2013 2013-04-08 10:04:00 IP Cores & Design
Tata Elxsi unveils H.264 Ultra Low Latency Codecs with 13 ms end to end latency 2013-04-08 09:20:00 SoC Architecture & Assembly
Brite's USB 2.0 OTG PHY Implementation Using SMIC 0.11um Process Receives USB-IF Certification 2013-04-08 09:18:00 IP Cores & Design
Altera Showcases 4K Video Processing and Multichannel Video-over-IP at 2013 NAB Show 2013-04-08 08:54:00 SoC Architecture & Assembly
Tata Elxsi unveils HEVC Ultra HD (4K) Decoder for Smartphones, Tablets, Set Top Boxes, Gaming consoles and other CE devices 2013-04-08 05:24:00 SoC Architecture & Assembly
Open-Silicon Extends its TSMC VCA Partnership to Include Israel 2013-04-08 03:32:00 Strategic Partnerships
Mentor Graphics Announces the First IP to System, UPF-based Low-power Verification Solution 2013-04-08 02:35:00 EDA & Design Tools
ARM and Cadence Partner to Implement Industry's First Cortex-A57 64-bit Processor on TSMC 16nm FinFET Process 2013-04-05 11:48:00 EDA & Design Tools
More Than One Fourth of Industry Wafer Capacity Dedicated to <40nm Process Geometries 2013-04-04 17:31:00 Analysis & Insight
Cryptography Research and StarChip sign patent license agreement for DPA countermeasures 2013-04-04 15:50:00 Legal & IP Strategy