Infineon and GLOBALFOUNDRIES Announce Joint Development and Production Collaboration for 40nm Embedded Flash Process Technology 2013-04-29 13:32:00 Foundries & Process Nodes
DOLPHIN INTEGRATION announces the best noise and linearity performances on the market of its circuit for space application 2013-04-26 15:22:00 IP Cores & Design
CEVA Introduces World's First Software-Based Super-Resolution Technology for Low Energy Mobile Applications 2013-04-25 12:10:00 SoC Architecture & Assembly
Xilinx Announces Fiscal 2013 Results; Q4 Sales Increase 4% Sequentially 2013-04-25 08:16:00 Financials
NASA Selects Ridgetop Group to Develop an Innovative Modular SiGe 130 nm Cell Library 2013-04-25 07:29:00 Commercial Deals
Cadence Reports First Quarter 2013 Financial Results and Completes Acquisition of Tensilica 2013-04-25 07:26:00 Financials
AMD Targets High-Growth, Embedded Markets with New AMD Embedded G-Series System-on-Chip 2013-04-23 16:20:00 SoC Architecture & Assembly
ARM Releases Free Industry Standard Development Tools For Its Embedded Linux Community 2013-04-23 13:23:00 SoC Architecture & Assembly
DMP 3D Graphics IP Core "SMAPH-S" is selected by Renesas Electronics 2013-04-23 13:21:00 Commercial Deals
S3 Group Announces Latest Release to its RF and Mixed Signal IP Product Guide 2013-04-23 09:13:00 IP Cores & Design