Vendor: M31 Technology Corp. Category: Single-Protocol PHY

USB 2.0 PHY in TSMC(6nm, 7nm, 12nm, 16nm, 22nm, 28nm, 40nm, 55nm, 65nm, 90nm)

M31 provides customers the next generation of USB 2.0 IP with an extremely compact die area and lower active and suspend power co…

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USB 2.0 TSMC 7nm N7+ View all specifications

Overview

M31 provides customers the next generation of USB 2.0 IP with an extremely compact die area and lower active and suspend power consumption. M31 utilizes a whole new design architecture to implement the USB 2.0 IP without sacrificing the performance associated with USB 2.0. The USB 2.0 IP is not only suitable for USB peripherals, but also an optimized solution for SOCs that desire multiple USB ports.

Key features

  • Smallest USB 2.0 PHY IP worldwide (IP size of 55nm, 40nm, 28nm, and 16/12nm are less than 0.2mm2)
  • Fully compliant with Universal Serial Bus (USB) 2.0 electrical specification
  • Compliant with UTMI+ specifications (High-Speed, Full-Speed, and Low-Speed functions)
  • Supports clock inputs from 10/12/19.2/24/25/27/30/40MHz crystal oscillator or external clock source
  • Integrated PLL to provide a variety of stand-alone clock outputs for USB related applications

Silicon Options

Foundry Node Process Maturity
TSMC 7nm N7+ —

Specifications

Identity

Part Number
M31 USB 2.0 PHY
Vendor
M31 Technology Corp.
Type
Silicon IP

Standards & Interfaces

Supported Standards
USB 2.0

Files

Product Sheet Download

Note: some files may require an NDA depending on provider policy.

Provider

Contact M31 Technology Corp.

Learn more about Single-Protocol PHY IP core

UFS Goes Mainstream

UniversalFlash Storage (UFS) was created for mobile applications and computer systems requiring high performance and low power consumption. These systems typically use embedded Flash based on the JEDEC standard eMMC. UFS was defined by JEDEC as the evolutionary replacement for eMMC offering significantly higher memory bandwidth. The standard builds on existing standards such as the SCSI command set, the MIPI Alliance M-PHY and UniPro as well as eMMC form factors to simplify adoption and development.

Design IP Faster: Introducing the C~ High-Level Language

In this paper, we introduce a new high-level, dataflow programming language called C~ (“C flow”) that further increases productivity by raising the level of abstraction from behavioral descriptions, while overcoming the limitations of C for hardware design. We present the syntax and semantics of this language, and the framework that provides hardware and software code generation. This paper illustrates the benefits of using C~ for hardware design of a IEEE 802.3 MAC, synthesized for FPGA and for 90nm CMOS technology.

Universal Flash Storage: Mobilize Your Data

Universal Flash Storage (UFS) was created for mobile applications and computer systems requiring high performance and low power consumption. These systems typically use embedded Flash based on the JEDEC standard eMMC. UFS was defined by JEDEC as the evolutionary replacement for eMMC offering significantly higher memory bandwidth. The standard builds on existing standards such as the SCSI command set, the MIPI Alliance M-PHY and UniProSM as well as eMMC form factors to simplify adoption and development.

Can MIPI and MDDI Co-Exist?

Since MIPI and MDDI standards both target interfaces to cameras and displays on mobile devices, are two separate standards really needed?

Frequently asked questions about Single-Protocol PHY IP

What is USB 2.0 PHY in TSMC(6nm, 7nm, 12nm, 16nm, 22nm, 28nm, 40nm, 55nm, 65nm, 90nm)?

USB 2.0 PHY in TSMC(6nm, 7nm, 12nm, 16nm, 22nm, 28nm, 40nm, 55nm, 65nm, 90nm) is a Single-Protocol PHY IP core from M31 Technology Corp. listed on Semi IP Hub. It is listed with support for tsmc.

How should engineers evaluate this Single-Protocol PHY?

Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this Single-Protocol PHY IP.

Can this semiconductor IP be compared with similar products?

Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.

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