Overview
The Synopsys IP USB 2.0 femtoPHY provides designers with a complete physical (PHY) layer IP solution for low-power mobile and consumer applications such as smartphones, tablets, digital TVs, and media players. Offering reduced silicon cost and longer battery life, the Synopsys IP USB 2.0 femtoPHY IP delivers 50% smaller die area and minimizes active and suspend power consumption. The Synopsys IP USB 2.0 femtoPHY implements the latest USB battery charger version 1.2 and USB On-The-Go (OTG) version 2.0 specifications from the USB Implementer’s Forum (USB-IF) for dual role devices. Architected for the industry’s most advanced 1.8V process technologies, the USB 2.0 femtoPHY is designed with features created to minimize effects due to variations in foundry process, device models, packages, and board parasitic. The Synopsys IP USB 2.0 femtoPHY builds on years of customer success with Synopsys’ silicon-proven USB PHY IP product line, which has been ported to over 100 process nodes and configuration combinations ranging from 180- nm to 5-nm. When combined with the Synopsys Host, Device, and Dual Role digital controllers and verification IP, the Synopsys IP USB 2.0 femtoPHY delivers a complete low power and small die area solution for advanced system-on-chip (SoC) designs.
Learn more about Single-Protocol PHY IP core
Synopsys extended its long-standing collaboration with Infineon to deliver a Synopsys Virtualizer™ Development Kit (VDK) supporting Infineon’s AURIX™ RC1 microcontroller (MCU) family. The VDK equips automotive engineering teams with a virtual prototype of the AURIX™ RC1 MCU, Infineon’s new scalable computing platform for software-defined vehicle (SDV) and Physical AI applications.
Explore three agentic AI adoption paths that help chip design teams combine flexible AI stacks with trusted, physics-based engineering tools.
Supporting the European Chips Act, startups and research teams will gain access to Synopsys chip design solutions to advance Europe’s strategic goals in areas such as AI and high-performance computing (HPC)
Recognition highlights leadership in agentic AI design, advanced-node enablement, co-packaged optics, and silicon-proven IP for next-generation AI systems
Leading portfolio of engineering solutions positions Synopsys to capitalize on the continued expansion of digital and physical AI and the AI-driven transformation of engineering.
The companies signed an expansive, multi-year agreement to jointly develop GPT-Synopsys, a specialized model, optimized to use Synopsys EDA tools to perform semiconductor design workflows.