What is TSMC CLN5FF GLink GPIO?
TSMC CLN5FF GLink GPIO is a GPIO IP core from Global UniChip Corp. (GUC) listed on Semi IP Hub. It is listed with support for tsmc Available on request.
Vendor:
Global UniChip Corp. (GUC)
Category:
GPIO
TSMC CLN5FF GLink GPIO
IGID2DY01A GLink GPIO is one of the GLink series IPs.
Overview
IGID2DY01A GLink GPIO is one of the GLink series IPs. It provides low speed (up to 500 MHz) connection between two dies without requiring any initialization sequence. The IP is ready for operation immediately after reset; therefore it could be used to transfer configuration and control buses (I2C, SPI, etc.) across two dies. IGID2DY01A GPIO performs an 18-pair lane connection.
Key features
- 18 full-duplex lanes for die to die connections
- 2 redundant lanes for repair
- Maximum speed 500 Mbps
- Supports internal loopback test
- EHOST: APB, I2C, and JTAG register interface
- Share 0.75 V typical AVDD power with GLink Slice
- Operating junction temperature: -40 °C ~ 125 °C
- Process: TSMC 5 nm 0.75 V/1.2 V CMOS LOGIC FinFET Process
- Metal Scheme: 1P16M (1X_h_1Xb_v_1Xe_h_1Ya_v_1Yb_h_4Y_vhvh_2Yy2Yx2R)
- Analog hard macro size: 746.283 um x 183.988 um for horizontal macro (E-W orientation) and
- 183.957 um x 745.640 um for vertical macro (N-S orientation)
- Supports both horizontal and vertical GDS orientation
- Special Layer & Device: High R Resistance and ULVT
Silicon Options
| Foundry | Node | Process | Maturity |
|---|---|---|---|
| TSMC | 5nm | N5FF | Available on request |
Specifications
Identity
Part Number
IGID2DY01A
Vendor
Global UniChip Corp. (GUC)
Type
Silicon IP
Files
Note: some files may require an NDA depending on provider policy.
Provider
HQ:
Taiwan
Frequently asked questions about GPIO Pad Library IP cores
How should engineers evaluate this GPIO?
Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this GPIO IP.
Can this semiconductor IP be compared with similar products?
Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.