Vendor: Certus Semiconductor Category: GPIO

Flipchip 1.8V/3.3V I/O Library with ESD-hardened GPIOs in TSMC 12nm FFC/FFC+

A 1.8V/3.3V flip-chip I/O library with ESD-immune GPIOs and integrated POC circuitry in TSMC FFC/FFC+.

TSMC 12nm FFC+ View all specifications

Overview

A 1.8V/3.3V flip-chip I/O library with ESD-immune GPIOs and integrated POC circuitry in TSMC FFC/FFC+.

This library is a production-ready I/O library built on the TSMC 12nm process. The library features 1.8V to 3.3V GPIOs with programmable drive strength, hysteresis, and control logic. It includes support cells for all power domains: 0.8V, 1.8V, and I/Oand incorporates latch-up immune, JEDEC-compliant ESD structures. The library is designed for flip-chip packaging and includes vertical and horizontal variants to support all die edge orientations. All power domains include integrated power-on control (POC) cells for safe and reliable sequencing.

Operating Conditions

Parameter Value
VDDIO 1.8V / 3.3V +/-10%
Core VDD 0.8V +/-10%
Tj -40°C to 125°C

Cell Size and Metal Stack

Cell Size Metal Stack
MH_IO 25um x 53um
MH_VDDIO_POC 50um x 53um
Metal Stack 1P9M

Library Cell Summary

Cell Type Feature
MH_IO 1.8V/3.3V GPIO, 2-bit drive strength
MH_VDDIO_ POC POC and ESD protection
MH_VDD / VDD18 0.8V / 1.8V power cells w/ ESD
MH_CORNER Power continuity at pad corner

Key features

GPIO Features

  • Dual drive strength control (DS0/DS1)
  • Output enable, input hysteresis, pull-up/down control
  • Fully ESD compliant with local clamp topology

Power and POC Features

  • Dedicated VDDIO, VDD18, and VDD core power pads
  • Integrated POC signals for safe sequencing
  • Required for robust ESD paths across pad ring

Compliance

  • 2kV HBM per JEDEC JS-001
  • 500V CDM
  • Latch-up immune
  • Flip-chip compatible

Block Diagram

Silicon Options

Foundry Node Process Maturity
TSMC 12nm FFC+

Specifications

Identity

Part Number
MH12
Vendor
Certus Semiconductor
Type
Silicon IP

Files

Note: some files may require an NDA depending on provider policy.

Provider

HQ: United States

Learn more about GPIO IP core

One Platform, Five Libraries: Certus Semiconductor’s I/O IP Portfolio for Every Application on TSMC 22nm ULL/ULP Technologies

Certus Semiconductor’s I/O libraries for TSMC’s 22nm ultra-low leakage (22ULL) and 22nm ultra-low power (22ULP) technologies offer robust, high-performance solutions tailored to a wide range of SoC designs — from ultra-low power IoT nodes to demanding consumer and automotive systems. Whether you need low leakage, high drive strength, or analog compatibility, our production-proven IP covers it all.

Frequently asked questions about GPIO Pad Library IP cores

What is Flipchip 1.8V/3.3V I/O Library with ESD-hardened GPIOs in TSMC 12nm FFC/FFC+?

Flipchip 1.8V/3.3V I/O Library with ESD-hardened GPIOs in TSMC 12nm FFC/FFC+ is a GPIO IP core from Certus Semiconductor listed on Semi IP Hub. It is listed with support for tsmc.

How should engineers evaluate this GPIO?

Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this GPIO IP.

Can this semiconductor IP be compared with similar products?

Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.

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