Vendor: Synopsys, Inc. Category: Single-Protocol PHY

TSMC 22ULL 1.8V/3.3V SD/eMMC PHY AG2

Synopsys SD/eMMC PHY provides an optimal balance for cost and performance for storage solutions.

TSMC 22nm ULL View all specifications

Overview

Synopsys SD/eMMC PHY provides an optimal balance for cost and performance for storage solutions. Synopsys SD/eMMC PHY is a hard IP that can be used to implement a single interface that can accomplish 4-bit, 8-bit eMMC & 4-bit SD operations. It includes an optional digi logic circuitry which is required for high-speed operations. It complies with eMMC 5.1 (JESD84-B51A) and SDIO 6.0 JEDEC standards.

Key features

  • Completely hardened PHY solution along with programmable delay chains & IOs
  • Fully selectable output impedance
  • Compliant with eMMC 5.1 (JESD84-B51A) and SDIO 3.0 JEDEC Standard
  • Automotive G1/G2 supported, ASIL-B certified
  • Interoperability checks done with Synopsys Controllers
  • HBM 2KV, CDM 500V(up to 7A), Latch-up: +/-100mA @ 125ºC
  • Silicon validated IP
  • Designed to support multiple metal stack options
  • Support for flip-chip & wirebond packaging

Block Diagram

Silicon Options

Foundry Node Process Maturity
TSMC 22nm ULL —

Specifications

Identity

Part Number
dwc_io_ts22ull_af_3p3v1p8v_sdemmcphy_ag2
Vendor
Synopsys, Inc.
Type
Silicon IP

Files

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Provider

Learn more about Single-Protocol PHY IP core

Frequently asked questions about Single-Protocol PHY IP

What is TSMC 22ULL 1.8V/3.3V SD/eMMC PHY AG2?

TSMC 22ULL 1.8V/3.3V SD/eMMC PHY AG2 is a Single-Protocol PHY IP core from Synopsys, Inc. listed on Semi IP Hub. It is listed with support for tsmc.

How should engineers evaluate this Single-Protocol PHY?

Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this Single-Protocol PHY IP.

Can this semiconductor IP be compared with similar products?

Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.

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