Vendor: TES Electronic Solutions Category: RF Front End

TS-4x8 V-Band Array Antenna 4x8 Array Antenna, 57 – 67 GHz V-Connector 1.85 mm

The TS-4x8 V-Band Array Antenna is a 57 to 67 GHz planar antenna with a bore-sight gain of min.

Overview

The TS-4x8 V-Band Array Antenna is a 57
to 67 GHz planar antenna with a bore-sight
gain of min. 14 dBi (18 dBi without feed
losses) measured at V-connector at 60 GHz
(simulated antenna gain without feed
network 20 dBi). The array can be offered
as fixed angle of steerable antenna.

Key features

  • Application Specific Customizable
  • Wide frequency range 57 - 67GHz
  • Return Loss: 10 dB typical
  • Gain: 14-15dBi at V-Connector
  • 18-19 dBi array antenna
  • considering losses in feed network

Benefits

  • Electrical and Mechanical specifications, TA=25 °C, 50 Ohm system
  • Frequency Range Min = 57, Max= 67, Units = GHz.
  • Gain (measured at V-Connector at 60 GHz) Min =14, Typ= 15, Units = dBi
  • Return Loss Min = 10, Units = dB
  • Size (with V-connector and carrier) = 110mm x 85mm x 16mm
  • V-Connector 1.85 mm

Applications

  • Short range P2P V-Band wireless
  • communication systems
  • Test, validation system level

Specifications

Identity

Part Number
67 GHz planar antenna TS-4x8 V-Band Array Antenna 57 to 67 GHz
Vendor
TES Electronic Solutions
Type
Silicon IP

Provider

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Frequently asked questions about RF Front End IP cores

What is TS-4x8 V-Band Array Antenna 4x8 Array Antenna, 57 – 67 GHz V-Connector 1.85 mm?

TS-4x8 V-Band Array Antenna 4x8 Array Antenna, 57 – 67 GHz V-Connector 1.85 mm is a RF Front End IP core from TES Electronic Solutions listed on Semi IP Hub.

How should engineers evaluate this RF Front End?

Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this RF Front End IP.

Can this semiconductor IP be compared with similar products?

Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.

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