Vendor: VeriSilicon Microelectronics (Shanghai) Co., Ltd. Category: DC/DC Converter

SMIC 0.13µm 5V-3.3V 350mA Synchronous Buck DC-DC

The IP is a high efficiency, low ripple, current mode buck switching regulator with internal synchronous MOS switches, eliminatin…

SMIC 130nm G View all specifications

Overview

The IP is a high efficiency, low ripple, current mode buck switching regulator with internal synchronous MOS switches, eliminating the need for external Schottky diode.

Key features

  • Process: SMIC 0.13μm 3.3V/1.2V 1P6/7/8M Logic Process
  • Efficiency: 90% when IOUT=350mA; 80% when IOUT=2.5mA (VIN=5V)
  • Input Voltage: 4.0~5.5V
  • Output Voltage: 3.3V±5%
  • Max Output Current: 350mA
  • Oscillation Frequency: ~1MHz
  • Over Current Protected: ~800mA
  • Standby Current: <300μA when VIN=5V, IOUT=0A
  • Shut Down Current: <10μA when VIN=5V
  • Soft Start Time: typical 0.8ms from active E to VOUT=3.3V
  • External inductor: 4.7μH with DCR lower than 100mΩ
  • External Output Capacitor: 4.7μF with ESR from 25mΩ to 200mΩ
  • External Input Capacitor: 4.7μF with low ESR
  • Operating Junction Temperature: -40°C~+25°C~+125°C

Silicon Options

Foundry Node Process Maturity
SMIC 130nm G —

Specifications

Identity

Part Number
S13V33_DCDCBK_03
Vendor
VeriSilicon Microelectronics (Shanghai) Co., Ltd.
Type
Silicon IP

Provider

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Frequently asked questions about DC-DC Converter IP cores

What is SMIC 0.13µm 5V-3.3V 350mA Synchronous Buck DC-DC?

SMIC 0.13µm 5V-3.3V 350mA Synchronous Buck DC-DC is a DC/DC Converter IP core from VeriSilicon Microelectronics (Shanghai) Co., Ltd. listed on Semi IP Hub. It is listed with support for smic.

How should engineers evaluate this DC/DC Converter?

Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this DC/DC Converter IP.

Can this semiconductor IP be compared with similar products?

Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.

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