VeriSilicon Launches GCNanoOptimaV, a Next-Generation 2.5D GPU IP for Wearables

Architectural Innovations and Advanced Hardware Acceleration Deliver Enhanced Graphics Performance and Power Efficiency for Emerging Wearable Applications

Shanghai, China -- November 5, 2026 -- VeriSilicon (688521.SH) today announced its next-generation GCNanoOptimaV 2.5D Graphics Processing Unit (GPU) IP, designed to meet the growing demand for advanced graphics capabilities in wearable devices. Featuring dedicated hardware acceleration engines and an optimized memory architecture, GCNanoOptimaV significantly enhances graphics rendering performance and memory efficiency, enabling richer and more responsive graphical user interfaces (GUIs) while addressing the stringent resource constraints of wearable applications. The new GPU IP has already been adopted by multiple leading customers.

GCNanoOptimaV incorporates dedicated hardware stroke and ellipse engines to address performance bottlenecks in vector graphics rendering. Its hardware stroke engine significantly improves the rendering performance of complex lines and curves, particularly in applications such as health monitoring, fitness tracking, and navigation. In addition, its innovative mesh rendering architecture reduces on-chip SRAM requirements, enabling more memory-efficient GPU integration in resource-constrained SoC designs.

GCNanoOptimaV also integrates VeriSilicon’s latest DECNano 3.0 compression engine, delivering improved image quality while maintaining a fixed 2:1 compression ratio. The GPU maintains compatibility with VeriSilicon's VGLite graphics API and supports widely adopted graphics frameworks and formats, including LVGL, SVG, and PNG. This software compatibility facilitates the migration of existing applications with minimal modifications, simplifying system integration and accelerating product development.

“Wearable devices are evolving rapidly, with increasingly sophisticated applications driving demand for greater functionality and higher graphics performance, while power consumption and memory footprint remain critical constraints,” said Weijin Dai, Chief Strategy Officer, Executive Vice President and General Manager of the IP Division at VeriSilicon. “Through architectural innovations and advanced hardware acceleration, our next-generation 2.5D GPU IP delivers measurable performance improvements and power savings in applications such as mapping and navigation. We are excited to bring these advancements to the wearable market, enabling richer visual experiences within the stringent power and memory budgets.”

Explore VeriSilicon IP:

• Vivante 2.5D GPU IP

About VeriSilicon

VeriSilicon Microelectronics (Shanghai) Co., Ltd. (VeriSilicon, 688521.SH) is a leading publicly listed provider of custom silicon solutions, with a comprehensive and proprietary portfolio of semiconductor IPs, and a long-standing focus on AI ASIC custom silicon.

The Company owns six categories of proprietary processing IPs — Graphics Processing Unit (GPU) IP, Neural Network Processing Unit (NPU) IP, Video Processing Unit (VPU) IP, Digital Signal Processing (DSP) IP, Image Signal Processing (ISP) IP and Display Processing IP — as well as more than 1,700 analog and mixed-signal IPs, including RF IPs and interface IPs.

Leveraging its in-house IPs, the Company has built an AI ASIC platform portfolio spanning cloud, edge and device, including the High-Performance SoC Platform, High-Performance AIGC Platform, Video Transcoding Platform, AutoDrive SoC Platform, AI ISP SoC Platform and Ultra-Low Power AI/AR Glass SoC Platform. Targeting key segments such as data centers, smart vehicles, AI smartphones and AI PCs, smart glasses and wearables, and embodied intelligence, these platforms provide one-stop custom services covering chip definition and architecture design through to mass production.

In response to the trend of System-on-Chip (SoC) evolving towards System-in-Package (SiP) driven by the demand for greater computing power, VeriSilicon advances Chiplet R&D and industrialization under the principles of “IP as a Chiplet”, “Chiplet as a Platform” and “Platform as an Ecosystem”, starting from interface IP, Chiplet architecture and advanced packaging technologies.

Under its unique Silicon Platform as a Service (SiPaaS) business model, the Company serves a broad range of markets including consumer electronics, automotive electronics, computers and peripherals, industrial, data processing and the Internet of Things (IoT). Its main customers include fabless companies, IDMs, system vendors (OEM/ODM), large internet companies and cloud service providers.

Founded in 2001 and headquartered in Shanghai, China, VeriSilicon has 9 design and R&D centers and 10 sales and customer service offices worldwide, and currently employs more than 2,000 people.