Vendor: T2M GmbH Category: Multi-Protocol PHY

PCIe 4.0 Serdes PHY IP, Silicon Proven in UMC 28HPC

With compliance for PIPE 4.4 interface spec, Peripheral Component Interconnect Express (PCIe) Gen4 PHY IP complies with PCIe 4.0 …

UMC 28nm HPC In Production View all specifications

Overview

With compliance for PIPE 4.4 interface spec, Peripheral Component Interconnect Express (PCIe) Gen4 PHY IP complies with PCIe 4.0 Base Specification. Capability for additional PLL control, reference clock control, and inbuilt power gating control leads to reduced power usage. Additionally, because the previously mentioned low power mode setting is programmable, the PHY is broadly suitable for a wide range of scenarios with diverse power consumption constraints.

Key features

  • Compliant with PCIe 4.0 Base Specification
  • Compliant with PIPE 4.4
  • Supported data transfer rate: 2.5 GT/s, 5.0 GT/s, 8.0 GT/s and 16.0 GT/s
  • Supported physical lane width: x4
  • Supported parallel interface: 16-bit and 32-bit
  • Supported input reference clock: 100 MHz
  • Supported input crystal clock for SRIS: 25 MHz
  • Supported parallel interface data clock: 62.5 MHz, 125 MHz and 250 MHz and 500MHz
  • Supporting low power operation with configurable setting in power state P1/P2/L1 PM Substates: PLL control, reference clock control, and embedded power gating control
  • TSMC 28nm HPCP 1P9M4X2Y2R (HVT/LVT/EHVT/SVT) process
  • Operating Voltage: 0.9V, 0.95V, 1.2V and 1.8V
  • Wire-bond
  • Providing robust testability by low-cost Build-In Self-Test (BIST) via near-end analog and external loopback interface as well as far-end.

Block Diagram

What’s Included?

  • Application Note / User Manual
  • Behavior model, and protected RTL codes
  • Protected Post layout netlist and
  • Standard Delay Format (SDF)
  • Synopsys library (LIB)
  • Frame view (LEF)
  • Metal GDS (GDSII)
  • Test patterns and Test Documentation

Silicon Options

Foundry Node Process Maturity
UMC 28nm HPC In Production

Specifications

Identity

Part Number
PCIe 4.0 Serdes PHY IP in 28HPC
Vendor
T2M GmbH
Type
Silicon IP

Files

Note: some files may require an NDA depending on provider policy.

Provider

HQ: Germany

Learn more about Multi-Protocol PHY IP core

How a 16Gbps Multi-link, Multi-protocol SerDes PHY Can Transform Datacenter Connectivity

Increasingly, more of the focus on mobile has centered around cloud datacenters and the networking to get the data back and forth between these datacenters and the mobile device. Functions like voice recognition and mapping depend on the ability to split the functionality between the smartphone, for local processing like encryption and compression, and the back end, where a large number of servers can do the heavier lifting before returning the results.

One PHY, Zero Tradeoffs: Multi-Protocol PHY for Edge AI Interface Consolidation

The Cadence 10G multi-protocol PHY was architected to address this exact challenge. Designed to scale across multiple process nodes, it consolidates PCI Express (PCIe), USB, DisplayPort, Ethernet, and other interfaces into a single, compact, silicon-efficient block. What sets it apart is simultaneous multi-protocol support, which enables multiple data paths without duplicating hardware, requiring extra board connectors, or paying the area and power penalty of separate IP blocks.

Frequently asked questions about Multi-Protocol PHY IP cores

What is PCIe 4.0 Serdes PHY IP, Silicon Proven in UMC 28HPC?

PCIe 4.0 Serdes PHY IP, Silicon Proven in UMC 28HPC is a Multi-Protocol PHY IP core from T2M GmbH listed on Semi IP Hub. It is listed with support for umc In Production.

How should engineers evaluate this Multi-Protocol PHY?

Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this Multi-Protocol PHY IP.

Can this semiconductor IP be compared with similar products?

Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.

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