Vendor: Cadence Design Systems, Inc. Category: HBM

HBM4E PHY and controller

The High-Bandwidth Memory generation 4 (HBM4E) PHY is optimized for systems that require the highest-bandwidth, low-latency memory solution.

Controller + PHY View all specifications

Overview

Providing a Complete Solution for HBM4

The Cadence High-Bandwidth Memory generation 4 (HBM4E) PHY is optimized for systems that require the highest-bandwidth, low-latency memory solution. The memory subsystem consisting of PHY and controller supports data rates up to 12.8Gbps per data pin, featuring 32 independent channels, for a total data width of 2048 bits. The PHY is designed for a 2.5D system with a silicon interposer to route signals between the 3D DRAM stack and PHY. 

The fourth-generation design is optimized for low power consumption and low PHY area. Cadence provides the complete solution including PHY, controller, interposer, and package.

Key features

  • Advanced clocking architecture minimizes clock jitter
  • DFI PHY Independent Mode for initialization and training
  • IEEE 1500 interface, memory BIST feature, and loop-back function
  • Supports lane repair
  • Designed for optimized interposer routing

Block Diagram

HBM4E block diagram

Benefits

  • Highest Performance: HBM4E up to 12.8Gbps per pin
  • Low Latency: For data-intensive applications
  • Low Power and Area: Low-power control and advanced low-power modes with power down
  • Complete HBM Solution: Full system design including PHY, controller, interposer, and package
  • Easy integration: PHY is hardened and timing closed, including all I/O and decoupling capacitors
  • Excellent Support: Access to Cadence expert SI/PI team to support customer designs

Specifications

Identity

Part Number
HBM4E
Vendor
Cadence Design Systems, Inc.
Type
Silicon IP
Controller / PHY
Controller + PHY

Files

Product Sheet Download

Note: some files may require an NDA depending on provider policy.

Provider

Learn more about HBM IP core

PCI Express Security and TEE Integration, Part 1 - Establishing Trust

Protecting processor memory alone is no longer sufficient. The entire I/O path must become part of the trusted computing architecture. To address this challenge, PCI-SIG® has developed a suite of complementary security technologies, including Data Object Exchange (DOE), Component Measurement and Authentication (CMA), Integrity and Data Encryption (IDE), and the TEE Device Interface Security Protocol (TDISP).

How a Multi-Protocol PHY Simplifies Physical AI Connectivity

Physical AI systems must move large amounts of data across two very different connectivity domains. Accelerators and local storage need high-bandwidth, low-latency links close to the compute SoC, while sensors and control modules require reliable connectivity across the larger platform. Supporting both domains with separate high-speed PHYs can increase silicon area and integration complexity.

Frequently asked questions about HBM Interface IP

What is HBM4E PHY and controller?

HBM4E PHY and controller is a HBM IP core from Cadence Design Systems, Inc. listed on Semi IP Hub.

How should engineers evaluate this HBM?

Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this HBM IP.

Can this semiconductor IP be compared with similar products?

Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.

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