Vendor: MSquare Category: HBM

HBM3 PHY and Controller.

MSquare's HBM3 IP (the 3rd generation of High-Bandwidth Memory) is specifically tailored for applications that require high memor…

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Controller + PHY View all specifications

Overview

MSquare's HBM3 IP (the 3rd generation of High-Bandwidth Memory) is specifically tailored for applications that require high memory throughput and low latency, complying with the JESD238 memory standard. It includes both PHY and Memory Controller components, supporting HBM3 SDRAM speeds ranging from 4.8Gbps/pin to 6.4Gbps/pin. Flexible configurations are available, including PHY Only, PHY + Controller, and Controller Only, to accommodate diverse customer design specifications. Additionally, the chip's footprint and power consumption are highly competitive within the industry.

Key features

  • Designed for high memory throughput and low latency applications
  • Consists PHY and Memory Controller
  • Optimized for 12nm process
  • Supports speed up to 6.4Gbps/pin
  • Features integrated PLL and IO
  • Flexible configurations available: (PHY only) or ( PHY + Controller) or (Controller only)
  • Supports both firmware-based training and hardware-based training
  • Optional Add-on IPs to achieve best performance
  • Minimized footprint and power consumption

Specifications

Identity

Part Number
HBM3
Vendor
MSquare
Type
Silicon IP
Controller / PHY
Controller + PHY

Files

Product Sheet Download

Note: some files may require an NDA depending on provider policy.

Provider

MSquare
HQ: China
Contact MSquare

Learn more about HBM IP core

Reducing Avoidable Memory Trips In HBM Systems

As AI and high-performance SoCs increasingly rely on HBM, memory bandwidth alone is no longer enough to maximize performance. This article discusses why the intelligent data movement and cache efficiency are critical to unlocking the full benefits of HBM-based architectures.

Making Strong Error-Correcting Codes Work Effectively for HBM in AI Inference

LLM inference is increasingly memory-bound, and HBM cost per GB now dominates system cost. Today’s HBM stacks include short on-die ECC, which tightens binning, raises price, and locks reliability policy inside the device. This paper asks a simple question: can we tolerate a much higher raw HBM bit error rate (BER) and still keep end-to-end correctness and throughput, without changing the HBM PHY or the fixed 32B transaction size?

High Bandwidth Memory Evolution from First Generation HBM to the Latest HBM4

HBM4 is the latest generation of the High Bandwidth Memory (HBM) that has become analogous to the Artificial Intelligence (AI) boom that is everywhere in today’s world. HBM is also increasingly being used in other applications like Data centers, autonomous driving systems, servers, cloud computing just to mention few domains where bandwidth and performance in a key requirement.

Breaking the HBM Bit Cost Barrier: Domain-Specific ECC for AI Inference Infrastructure

High-Bandwidth Memory (HBM) delivers exceptional bandwidth and energy efficiency for AI workloads, but its high cost per bit, driven in part by stringent on-die reliability requirements, poses a growing barrier to scalable deployment. This work explores a systemlevel approach to cost reduction by eliminating on-die ECC and shifting all fault management to the memory controller.

Frequently asked questions about HBM Interface IP

What is HBM3 PHY and Controller.?

HBM3 PHY and Controller. is a HBM IP core from MSquare listed on Semi IP Hub.

How should engineers evaluate this HBM?

Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this HBM IP.

Can this semiconductor IP be compared with similar products?

Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.

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