USB1.1 PHY Feature USB 1.1 On-The-Go PHY; UMC 0.11um HS/AE (AL Enhancement) Logic Process, without internal power clamping circuit
- UCIe 1.1
- UMC
- 110nm
- HS
- Pre-Silicon
Interface and connectivity IP cores enable communication between components, chips, and systems in modern SoC and ASIC designs.
These IP cores implement a wide range of communication standards including high-speed serial interfaces, on-chip interconnects, chiplet and die-to-die links, and low-speed control interfaces.
This catalog allows you to explore and compare connectivity IP cores from leading vendors based on bandwidth, latency, protocol support, and process node compatibility.
Whether you are designing high-performance computing systems, data center processors, automotive platforms, or embedded systems, you can find the right interface IP for your communication requirements.
USB1.1 PHY Feature USB 1.1 On-The-Go PHY; UMC 0.11um HS/AE (AL Enhancement) Logic Process, without internal power clamping circuit
UMC 28nm HPC/Low-K process , 1.25G-16Gbps 4-Lane SERDES
UMC 28nm HPC/Low-K process , 1.25G-16Gbps 4-Lane SERDES
3.3V LVDS Transmitter 16~100MHz; 55nm SP/RVT LowK Logic Process
3.3V LVDS Transmitter 16~100MHz; 55nm SP/RVT LowK Logic Process
2.5V LVDS Transmitter 1.25Gbps; UMC 40nm LP LowK Logic Process.
2.5V LVDS Transmitter 1.25Gbps; UMC 40nm LP LowK Logic Process.
3.3V LVDS Transmitter 700Mbps; UMC 40nm LP LowK Logic Process
3.3V LVDS Transmitter 700Mbps; UMC 40nm LP LowK Logic Process
3.3V FPD-link LVDS Transmitter 16~100MHz; UMC 28nm HPC process
3.3V FPD-link LVDS Transmitter 16~100MHz; UMC 28nm HPC process
2.5V FPD-link LVDS Transmitter 16~178.6MHz; UMC 40nm LP Low-K process
2.5V FPD-link LVDS Transmitter 16~178.6MHz; UMC 40nm LP Low-K process
3.3v LVDS RX, 3 data lane and 1 clock lane using UMC 40nm LP/RVT LowK Logic Process
3.3v LVDS RX, 3 data lane and 1 clock lane using UMC 40nm LP/RVT LowK Logic Process
UMC 28nm HPC Logic Process, LVDS RX Receives serial LVDS signal and de-serialize them into parallel format
10 lane FXSLVTX030HH0L bias circuit ; UMC 40nm LP/RVT Logic Process
10 lane FXSLVTX030HH0L bias circuit ; UMC 40nm LP/RVT Logic Process
10BASE-T/100BASE-TX/100BASE-FX/1000BASE-T Gigabit Energy Efficient Ethernet PHY; UMC 28nm HPC/Low-K process
Input 80MHz-280MHz, DQS delay 3.125%-50% of FREF period, UMC 55nm SP/RVT Low-K logic process.
Input 80MHz-280MHz, DQS delay 3.125%-50% of FREF period, UMC 55nm SP/RVT Low-K logic process.
Input 80MHz-280MHz, DQS delay 6.25%-50% of FREF period, UMC 40nm LP/RVT Low-K logic process.
Input 80MHz-280MHz, DQS delay 6.25%-50% of FREF period, UMC 40nm LP/RVT Low-K logic process.
UMC 55nm LP/RVT Low-K logic process, Operating frequency 80MHz-320MHz, DQS delay 6.25%-50%.
UMC 55nm LP/RVT Low-K logic process, Operating frequency 80MHz-320MHz, DQS delay 6.25%-50%.
10BASE-Te/100BASE-TX/100BASE-FX/1000BASE-T Energy Efficient Ethernet PHY; UMC 28nm HPC+ process
10BASE-Te/100BASE-TX/100BASE-FX/1000BASE-T Energy Efficient Ethernet PHY; UMC 28nm HPC+ process
USB 2.0 On-The-Go PHY; UMC 28nm HLP Process
USB 2.0 On-The-Go PHY; UMC 28nm HLP Process
USB2.0 On-The-Go PHY; UMC 28nm HPC RVT Logic Process_x005F_x000D_ cost down from FZOTG266HJ0C_A
USB2.0 On-The-Go PHY; UMC 28nm HPC RVT Logic Process cost down from FZOTG266HJ0C_A
USB1.1 PHY Feature USB 1.1 On-The-Go PHY; UMC 55nm Logic e-Flash Process
USB1.1 PHY Feature USB 1.1 On-The-Go PHY; UMC 55nm Logic e-Flash Process
TypeC CC channel for USBPD ; UMC 40NM LP Low-K process.
TypeC CC channel for USBPD ; UMC 40NM LP Low-K process.
Analog part of TX+RX lane operating at 1.25G~8Gbps , UMC 28nm HPC Process
Analog part of TX+RX lane operating at 1.25G~8Gbps , UMC 28nm HPC Process