DDR4/ LPDDR4/ DDR3L PHY IP - 1866Mbps (Silicon Proven in TSMC 28HPC+)
The LPDDR4/ DDR4/ DDR3L Combo PHY IP offers low latency and supports throughput of up to 1866Mbps.
- Controller + PHY + 1
- LPDDR4
- TSMC
- 28nm
- HPC+
- In Production
Memory interface IP cores provide the critical connectivity layer between processing elements and memory devices, enabling high-bandwidth, low-latency, and power-efficient data access in modern SoC, ASIC, AI, networking, and high-performance computing designs.
This category includes DDR, LPDDR, GDDR, HBM, NAND Flash, and NOR Flash interface IP solutions, covering memory controllers, PHYs, controller-PHY subsystems, training engines, calibration logic, and complete memory interface architectures. These IP cores are designed to maximize memory bandwidth, optimize latency, ensure signal integrity, and simplify integration across advanced semiconductor process nodes.
DDR4/ LPDDR4/ DDR3L PHY IP - 1866Mbps (Silicon Proven in TSMC 28HPC+)
The LPDDR4/ DDR4/ DDR3L Combo PHY IP offers low latency and supports throughput of up to 1866Mbps.
DDR4/ LPDDR4/ DDR3L PHY IP - 3200Mbps (Silicon Proven in TSMC 12FFC)
The DDR4/ DDR3L/ LPDDR4 Combo PHY IP provides low latency and enables up to 3200Mbps throughput.
The LPDDR6/5X/5 PHY IP enables ASICs, ASSPs, system-on-chips (SoCs), and system-in-package applications requiring high-performanc…
LPDDR6/5X/5 PHY V2 - TSMC N5A for Automotive, ASIL B Random, AEC-Q100 Grade 2
The LPDDR6/5X/5 PHY IP enables ASICs, ASSPs, system-on-chips (SoCs), and system-in-package applications requiring high-performanc…
The LPDDR6/5X/5 PHY IP enables ASICs, ASSPs, system-on-chips (SoCs), and system-in-package applications requiring high-performanc…
The LPDDR6/5X/5 PHY IP enables ASICs, ASSPs, system-on-chips (SoCs), and system-in-package applications requiring high-performanc…
The LPDDR6/5X/5 PHY IP enables ASICs, ASSPs, system-on-chips (SoCs), and system-in-package applications requiring high-performanc…
The LPDDR6/5X/5 PHY IP enables ASICs, ASSPs, system-on-chips (SoCs), and system-in-package applications requiring high-performanc…
LPDDR6/5X/5 PHY V2 - TSMC N3A for Automotive, ASIL B Random, AEC-Q100 Grade 2
The LPDDR6/5X/5 PHY IP enables ASICs, ASSPs, system-on-chips (SoCs), and system-in-package applications requiring high-performanc…
The LPDDR6/5X/5 PHY IP enables ASICs, ASSPs, system-on-chips (SoCs), and system-in-package applications requiring high-performanc…
The LPDDR6/5X/5 PHY IP enables ASICs, ASSPs, system-on-chips (SoCs), and system-in-package applications requiring high-performanc…
The LPDDR6/5X/5 PHY IP enables ASICs, ASSPs, system-on-chips (SoCs), and system-in-package applications requiring high-performanc…
IGAHBMX03A is a HBM3 (High Bandwidth Memory) PHY IP compliant to the JEDEC HBM3 DRAM Specification Rev 0.95.
graphics, high-performance computing (HPC) and networking applications are requiring more memory bandwidth to keep pace with the …
graphics, high-performance computing (HPC) and networking applications are requiring more memory bandwidth to keep pace with the …
HBM2E PHY V2 (Hard 1) - TSMC 7FF18
graphics, high-performance computing (HPC) and networking applications are requiring more memory bandwidth to keep pace with the …
HBM2E PHY V2 (Hard 1) - TSMC 6FF18
graphics, high-performance computing (HPC) and networking applications are requiring more memory bandwidth to keep pace with the …
HBM2E PHY V2 (Hard 1) - TSMC 5FF12
graphics, high-performance computing (HPC) and networking applications are requiring more memory bandwidth to keep pace with the …
The HBM3 PHY is a physical layer IP interface (PHY) solution for high-performance computing (HPC), AI, graphics, and networking A…
The HBM3 PHY is a physical layer IP interface (PHY) solution for high-performance computing (HPC), AI, graphics, and networking A…