MIPI M-PHY v4.1 IP, Silicon Proven in TSMC 12FFC
The MIPI M-PHY Gear 4 IP is compliant with the latest MIPI Feature Storage IP Solution SerDes PHY Product Brief Alliance M-PHY v4…
- MIPI M-PHY
- TSMC
- 12nm
- FFC
- In Production
PHY and SerDes IP cores are essential building blocks for high-speed data transmission in modern semiconductor designs. This category includes physical layer IP and serializer/deserializer solutions used to implement reliable chip-to-chip, die-to-die, backplane and interface connectivity across networking, compute, storage, automotive and consumer applications.
Browse PHY / SerDes semiconductor IP for high-speed interfaces requiring robust signal integrity, scalable lane configurations, low power and standards-oriented interoperability. Compare controller-adjacent PHY IP, generic SerDes architectures and specialized high-speed connectivity solutions from multiple vendors for integration into ASICs, SoCs and advanced package designs.
MIPI M-PHY v4.1 IP, Silicon Proven in TSMC 12FFC
The MIPI M-PHY Gear 4 IP is compliant with the latest MIPI Feature Storage IP Solution SerDes PHY Product Brief Alliance M-PHY v4…
Our SerDes architecture is in production in processes ranging from 12nm to 180nm and at rates from 100Mbps to 32.75Gbps and prove…
2 Gbps Rail to Rail LVDS receiver
065TSMC_LVDS_10 is LVDS receiver with rail to rail input range.
1.2 Gbps LVDS transmitter/receiver
The interface to the core logic in receiver mode includes the signal pins (out_p and out_n) to receive data and the control pins …
1 Gbps Rail to Rail LVDS receiver
065TSMC_LVDS_08 is LVDS receiver with rail to rail input range.
065TSMC_LVDS_07 is LVDS transmitter.
Programmable CMOS LVDS Transmitter/Receiver
LVDS device consists of one common bandgap reference voltage generator, a number of LVDS transmitter pad groups with their bias b…
32Gbps SerDes IP in TSMC 12nm FFC
The relentless demand for higher data throughput in data centers and high-performance computing (HPC) systems drives the need for…
32Gbps SerDes IP in TSMC 22nm ULP
The relentless demand for higher data throughput in data centers and high-performance computing (HPC) systems drives the need for…
USB-C 3.1/DP TX PHY for TSMC 6FF, North/South Poly Orientation
The USB-C 3.1/DisplayPort Tx 1.3 Tx IP solution consists of USB-C 3.1/DisplayPort 1.3 PHYs, USB-C 3.1/DisplayPort 1.3 controllers…
USB 3.1 DisplayPort PHY - TSMC 10FF, North/South Poly Orientation
The USB-C 3.1/DisplayPort Tx 1.3 Tx IP solution consists of USB-C 3.1/DisplayPort 1.3 PHYs, USB-C 3.1/DisplayPort 1.3 controllers…
32Gbps, 31 order, Pseudo Random Bit Sequence Generator / Checker
This unit generates and checks Pseudo Random Bit Sequence (PRBS) of 31 order, up to 32Gbps.
USB 2.0 PHY IP, Silicon Proven in TSMC 16FFC
The entire physical layer (PHY) IP solution for USB 2.0 was created to provide exceptional performance and consume little power.
MIPI M-PHY v4.1 IP, Silicon Proven in TSMC 55 ULP
The most recent MIPI Feature Storage IP Solution SerDes PHY Product Brief Alliance M-PHY v4.1 Specification, UniPro v1.8 Specific…
MIPI M-PHY v4.1 IP, Silicon Proven in TSMC 40 LP
The MIPI M-PHY Gear 4 IP is compatible with the most recent MIPI Feature Storage IP Solution SerDes PHY Product Brief Alliance M-…
MIPI C/D-PHY Combo Rx IP, Silicon Proven in TSMC 40 LP
Many production nodes use the C-PHY/D-PHY Combo because it uses the fewest resources and energy.
MIPI C/D-PHY Combo Tx IP, Silicon Proven in TSMC 40 LP
C-PHY/D-PHY Combo in various production nodes at low cost and power.
MIPI C/D-PHY Combo Rx IP, Silicon Proven in TSMC 28 HPC+
Several production nodes employ C-PHY/D-PHY Combo to consume the least amount of energy and funds.
MIPI C/D-PHY Combo Tx IP, Silicon Proven in TSMC 28 HPC+
C-PHY/D-PHY Combo at low cost and power in several manufacturing nodes.
MIPI C/D-PHY Combo Rx IP, Silicon Proven in TSMC 22 ULP
In order to use the least amount of power and money, several production nodes use C-PHY/D-PHY Combo.