Vendor:
Arasan Chip Systems Inc.
Category:
High-Speed
eMMC 5.1 Device I/O Pad
The eMMC 5.1 Device I/O is verified to be fully compliant I/O interface for JEDEC eMMC 5.1 when rectified and eMMC 5.0 JESD84-B50…
Overview
The eMMC 5.1 Device I/O is verified to be fully compliant I/O interface for JEDEC eMMC 5.1 when rectified and eMMC 5.0 JESD84-B50 specification. It is backward compliant with eMMC4.51 and earlier versions of the specifications. This allows the designers of the SoC to easily support the EMMC interface and optimize the performance and power while maintaining interoperability with eMMC 5.0 and eMMC 5.1 hosts.
The eMMC 5.1 Device I/O PAD is a multipurpose PAD which can be programmed to operate in different modes:
- Output with predetermined source/ sink impedance
- Open drain
- Input
- Tristate
- Weak pull up or pull down
The PAD mode of operation is determined by DR_EN, OD_EN, REN, and PU control signal. When the push-pull mode is selected, the source/sink impedance can be programmed to 50, 33, 66, 100 or 40 Ohms. DR_TY control bits are used to select the desired source/sink impedance. The source/sink impedance variation with PVT exceeds 25 % of its nominal value, trimming bits are provided to greatly reduce the variation. RTRIM bits are used for this purpose. ARASAN CAL I/O can be used to automatically reduce the variation to less than 8%.
Key features
The following are the high level features of the ACS eMMC5.1 PHY:
- Designed for seamless integration with ACS’s eMMC5.1 Device Controller.
- Supports HS400, HS200, DDR50 and legacy operating modes.
- Includes EMMC I/O PADS with ESD protection structures.
- The ACS EMMC I/O PADS are designed to meet eMMC5.1 HS400 specifications.
- ACS eMMC5.1 PHY is available in the latest TSMC technology nodes.
- The design is intended for core supply VCORE +/-10% and I/O supply VCCQ +/-10%.
Block Diagram
eMMC 5.1 Device I/O Pad block diagram
Specifications
Identity
Part Number
eMMC 5.1 Device I/O Pad
Vendor
Arasan Chip Systems Inc.
Type
Silicon IP
Files
Note: some files may require an NDA depending on provider policy.
Provider
HQ:
USA
Learn more about High-Speed IP core
Accelerating Embedded Memory Performance with 16-bit xSPI PSRAM IP
As embedded systems continue to demand higher bandwidth, lower latency, and greater memory efficiency, designers are increasingly turning to advanced external memory interfaces to overcome traditional bottlenecks.
Arasan 16-bit xSPI/PSRAM Controller and PHY: Enabling High-Performance Embedded Memory Systems
As modern embedded systems continue to evolve toward AI-driven processing, advanced graphics, automotive intelligence, and high-speed edge computing, the demand for faster and more efficient external memory interfaces is rapidly increasing. Traditional SPI-based memory solutions are often unable to provide the bandwidth and low latency required by next-generation SoCs.
UFS 5.0: Enabling Next-Generation Storage with Arasan IP
UFS 5.0 represents the next leap in Universal Flash Storage, delivering unmatched bandwidth and efficiency. To help SoC designers quickly adopt this advanced standard, Arasan Chip Systems provides a comprehensive, silicon-proven UFS IP solution that accelerates design cycles and ensures seamless integration.
eUSB2V2: Trends and Innovations Shaping the Future of Embedded Connectivity
In an era defined by rapid technological advancement, embedded interfaces must evolve to meet the demands of smaller form factors, lower power budgets, and diversified use cases. Among these interfaces, eUSB2V2 (Embedded USB 2.0 Version 2) has emerged not just as a legacy-support PHY, but as a strategic enabler of robust, low-power connectivity across next-generation systems-on-chip (SoCs).
MIPI CCI over I3C: Faster Camera Control for SoC Architects
Imagine a camera subsystem that responds in microseconds, consumes less power, and offers a more straightforward route to time-to-market. For SoC architects and IP integration teams, that vision is increasingly possible with MIPI Camera Control Interface (CCI) over I3C.
Frequently asked questions about High-Speed I/O Pad IP
What is eMMC 5.1 Device I/O Pad?
eMMC 5.1 Device I/O Pad is a High-Speed IP core from Arasan Chip Systems Inc. listed on Semi IP Hub.
How should engineers evaluate this High-Speed?
Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this High-Speed IP.
Can this semiconductor IP be compared with similar products?
Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.