How Secure DDR Interfaces Protect DRAM from Memory Attacks
Brett Murdock, Dana Neustadter (Synopsys)
Vendor:
Faraday Technology
Category:
DDR
Data Block of DDR3 Combo PHY for DIMM version ; UMC 55nm SP/RVT LowK Logic Process
Data Block of DDR3 Combo PHY for DIMM version ; UMC 55nm SP/RVT LowK Logic Process
Overview
Data Block of DDR3 Combo PHY for DIMM version ; UMC 55nm SP/RVT LowK Logic Process
Silicon Options
| Foundry | Node | Process | Maturity |
|---|---|---|---|
| UMC | 55nm | SP | Pre-Silicon |
Specifications
Identity
Part Number
FXDDR3D300HF0A
Vendor
Faraday Technology
Type
Silicon IP
Controller / PHY
Controller + PHY
,
PHY
Standards & Interfaces
Memory
DDR3
Files
Note: some files may require an NDA depending on provider policy.
Provider
HQ:
Taiwan
Learn more about DDR IP core
The complete series of high-end DDR IP solutions of Innosilicon is industry-leading and across major foundry processes
In recent years, emerging industries such as AI, Internet of Things, 5G, and intelligent networked vehicles have flourished, and the high requirements for performance have greatly increased the scale and complexity of chips, constantly challenging IP limitations.
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Dana Neustadter, Senior Product Manager for Security Solutions, and Brett Murdock, Director, Product Line Management for Memory Interface IP, Synopsys Solutions Group
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Frequently asked questions about DDR Interface IP
What is Data Block of DDR3 Combo PHY for DIMM version ; UMC 55nm SP/RVT LowK Logic Process?
Data Block of DDR3 Combo PHY for DIMM version ; UMC 55nm SP/RVT LowK Logic Process is a DDR IP core from Faraday Technology listed on Semi IP Hub. It is listed with support for umc Pre-Silicon.
How should engineers evaluate this DDR?
Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this DDR IP.
Can this semiconductor IP be compared with similar products?
Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.