Command/Address Block of DDR3/DDR3L/DDR2/LPDDR2/LPDDR Combo PHY for Chip Application (compliant to DFI); UMC 55nm SP/RVT LowK Log…
- Controller + PHY + 1
- UMC
- 55nm
- SP
Memory interface IP cores provide the critical connectivity layer between processing elements and memory devices, enabling high-bandwidth, low-latency, and power-efficient data access in modern SoC, ASIC, AI, networking, and high-performance computing designs.
This category includes DDR, LPDDR, GDDR, HBM, NAND Flash, and NOR Flash interface IP solutions, covering memory controllers, PHYs, controller-PHY subsystems, training engines, calibration logic, and complete memory interface architectures. These IP cores are designed to maximize memory bandwidth, optimize latency, ensure signal integrity, and simplify integration across advanced semiconductor process nodes.
Command/Address Block of DDR3/DDR3L/DDR2/LPDDR2/LPDDR Combo PHY for Chip Application (compliant to DFI); UMC 55nm SP/RVT LowK Log…
UMC 55NM SP-RVT with 2.5V device DDR23 COMBO PHY CMD/ADDR Block for 2 layer PCB board usage
UMC 55NM SP-RVT with 2.5V device DDR23 COMBO PHY CMD/ADDR Block for 2 layer PCB board usage
1:2 DDR2/DDR1/MDDR combo PHY; UMC 0.11um HS/Cu Logic Process
1:2 DDR2/DDR1/MDDR combo PHY; UMC 0.11um HS/Cu Logic Process
DDRII Data Block for Chip Application; UMC 0.11um HS/AE (AL Advance Enhancement) Logic Process
DDRII Data Block for Chip Application; UMC 0.11um HS/AE (AL Advance Enhancement) Logic Process
1:2 DDR2/DDR1/MDDR combo PHY; UMC 0.11um HS/Cu Logic Process
1:2 DDR2/DDR1/MDDR combo PHY; UMC 0.11um HS/Cu Logic Process
DDR1/MDDR PHY Data block ; UMC 55nm SP/RVT with 2.5V device LowK Logic Process
DDR1/MDDR PHY Data block ; UMC 55nm SP/RVT with 2.5V device LowK Logic Process
DDR1/MDDR PHY CMD/ADDR BLOCK ; UMC 55nm SP/RVT with 2.5V device LowK Logic Process
DDR1/MDDR PHY CMD/ADDR BLOCK ; UMC 55nm SP/RVT with 2.5V device LowK Logic Process
Data Block of DDR3/DDR4/LPDDR2/LPDDR3 Combo PHY for Solder bump Flip chip version ; UMC 40nm LP LowK Logic Process
Command/Address Block of DDR3/DDR4/LPDDR2/LPDDR3 Combo PHY for Solder bump Flip chip version ; UMC 40nm LP LowK Logic Process
SMIC 65nm LL DDR3/DDR2/LPDDR2 COMBO interface for DRAM application
IP
SMIC 55nm LL LPDDR interface for DRAM application
IP
IP
SMIC 65nm LL LPDDR interface for mobile-DDR application
IP
IP
IP
DDR3/DDR2/LPDDR2 COMBO Interface
IP
DDR3 SDRAM Controller
Fast Access Controller – a plug-and-play IP solution for fast embedded Flash Programming and Memory Testing
Verilog IP for connecting to an External Hyperbus Memory chip.
Embedded synchronous single port SRAM/ROM memory controller with AXI slave port.
Embedded synchronous single port SRAM/ROM memory controller with AXI slave port.