Vendor: SMIC Category: LPDDR

SMIC 55nm LL LPDDR interface for DRAM application

Controller SMIC 55nm LL Silicon Proven View all specifications

Key features

  • LPDDR interface for DRAM application;
  • SMIC 55nm Logic Low Leakage 1P10M Salicide 1.2V/1.8V/2.5V Process;
  • Cell Size (Width * height) 35um * 174um with DUP stagger bonding pads;
  • Work voltage: 1.8V;
  • Programmable drive-strength, Schmitt?trigger?enable input,optional pullup,pulldown resistor; support data rate up to 400Mbps;
  • Suitable for 7, 8, 9 and 10 layers application ;

Silicon Options

Foundry Node Process Maturity
SMIC 55nm LL Silicon Proven

Specifications

Identity

Part Number
SP55NLLD2P_MDDR
Vendor
SMIC
Type
Silicon IP
Controller / PHY
Controller

Provider

HQ: China

Learn more about LPDDR IP core

LPDDR flash: A memory optimized for automotive systems

Next-generation automotive systems are advancing beyond the limits of currently available technologies. The addition of advanced driver assistance systems (ADAS) and other advanced features requires greater processing power and increased connectivity throughout the vehicle.

SOCAMM: Modernizing Data Center Memory with LPDDR6/5X

Small Outline Compression-Attached Memory Module (SOCAMM) has made its way into the data center as an alternative to external CPU memory, due to its high performance, low power, memory capacity, and scalability.

Frequently asked questions about LPDDR Interface IP

What is SMIC 55nm LL LPDDR interface for DRAM application?

SMIC 55nm LL LPDDR interface for DRAM application is a LPDDR IP core from SMIC listed on Semi IP Hub. It is listed with support for smic Silicon Proven.

How should engineers evaluate this LPDDR?

Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this LPDDR IP.

Can this semiconductor IP be compared with similar products?

Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.

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