Sharp and WiLAN Enter Wireless License Agreement
OTTAWA, Canada – June 17, 2010 – Wi-LAN Inc. (“WiLAN” or the “Company”) (TSX:WIN), a leading technology innovation and licensing company, today announced that Sharp Corporation (“Sharp”) and WiLAN have signed a license agreement related to certain of its wireless patents. The six year agreement covers a range of wireless products sold by Sharp including Wi-Fi-enabled notebooks and handsets. Remaining terms of the agreement are confidential.
Sharp is the 95th company and 10 th handset vendor to license WiLAN wireless technologies. About WiLAN WiLAN, founded in 1992, is a leading technology innovation and licensing company. WiLAN has licensed its intellectual property to over 220 companies worldwide. Inventions in our portfolio have been licensed by companies that manufacture or sell a wide range of communication and consumer electronics products including 3G cellular handsets, Wi-Fi-enabled laptops, Wi-Fi/DSL routers, xDSL infrastructure equipment, WiMAX base stations and digital television receivers. WiLAN has a large and growing portfolio of more than 850 issued or pending patents. For more information: www.wilan.com.
Related Semiconductor IP
- Band-Gap Voltage Reference with dual 2µA Current Source - X-FAB XT018
- 250nA-88μA Current Reference - X-FAB XT018-0.18μm BCD-on-SOI CMOS
- UCIe D2D Adapter & PHY Integrated IP
- Low Dropout (LDO) Regulator
- 16-Bit xSPI PSRAM PHY
Related News
- MVSILICON License and Deploy CEVA Bluetooth IP in its latest Wireless Audio Platform
- MorningCore Technology License CEVA DSP for High Performance Wireless and Automotive Communication Platforms
- WiLAN Signs Wireless License with LG
- WiLAN Subsidiaries Sign License Agreement with PSMC
Latest News
- SEMI Reports Worldwide Silicon Wafer Shipments Increase 13% Year-on-Year in Q1 2026
- POLYN Technology Announces Tapeout of Automotive Chip
- QuickLogic Establishes New Banking Relationship and Secures $10 Million Revolving Credit Facility
- TES is extending its PMU IP portfolio for X-FAB’s XT018 - 0.18µm BCD-on-SOI technology.
- RF Front-End Modules & Components IP Trends – Q1 2026 Monitoring Release