Wi-LAN and Texas Instruments Agree to Without Prejudice Dismissal
OTTAWA, Canada – August 15, 2008 – Wi-LAN Inc. (“Wi-LAN” or the “Company”) (TSX: WIN), a leading technology innovation and licensing company, today announced that the Company and Texas Instruments, Incorporated (TI) have agreed that TI will be dismissed from Wi-LAN’s legal action No. 2:07-cv-474 in the U.S. District Court for the Eastern District of Texas. The parties have also consented not to take any further proceedings against each other with respect to the Wi-LAN patents at issue in that action, for an agreed period of time. Despite this agreement, Wi-LAN will still have the right to seek damages from, or bring a future lawsuit against, TI for infringement of these patents.
About Wi-LANWi-LAN, founded in 1992, is a leading technology innovation and licensing company. Our portfolio of patented inventions applies to a wide range of consumer electronics and communications products. Some of the fundamental technologies covered by Wi-LAN’s patents include: CDMA, DOCSIS, DSL, GSM/EDGE, V‑chip, Wi-Fi and WiMAX. Wi-LAN has a large and growing portfolio of more than 300 issued or pending patents. Wi-LAN has licensed its intellectual property to over 130 companies. For more information: www.wi-lan.com.
Related Semiconductor IP
- ML-KEM-X Post-Quantum Cryptography Core
- AXI5 to/from AXI4 Bridge
- AXI5-Stream to/from AXI4-Stream Bridges
- APB5 to APB4 bridge
- UALink PHY + Controller
Related News
- Texas Instruments drives customer applications one lane closer to an autonomous driving experience and reduction in collisions
- Texas Instruments debuts first ARM Cortex-A8 processors for industrial computing applications
- Sundance Features New Texas Instruments TMS320C6472 Multicore DSP in its EVP6472 Development Platform
- Mentor Graphics Delivers Optimized Android Development System for the OMAP35x Processors from Texas Instruments
Latest News
- CAST Expands Functional Safety IP Line with ASIL B Ready SENT/SAE J2716 Receiver Core
- SkyeChip Advances Custom Interface IP Engagement with Cerebras for Wafer-Scale AI Platforms
- SEALSQ and GlobalFoundries Partner to Accelerate Post-Quantum Cryptography and Quantum Computing Technologies
- Arteris Announces Collaboration with IC-Link by imec to Accelerate Next-Gen AI and HPC Silicon
- SambaNova Completes First Close of $1B Financing at $11B Valuation