TTPCommunications and Alcatel announce Bluetooth Alliance
IP News TTPCommunications and Alcatel announce Bluetooth Alliance
Brussels/Melbourn, October 25th, 1999 -- TTPCom and Alcatel's microelectronics division (Alcatel on NYSE: ALA) announced today that they have signed an agreement for the development of a single-chip Bluetooth solution.
TTPCom will supply the base-band design and protocol stack and Alcatel will design the RF section, the interfaces and application layer software. Alcatel will also handle the chip integration and take care of manufacturing and sales. The result of this joint development will be an innovative single chip Bluetooth solution, expected to be available in the second half of 2000.
Alcatel has an extensive offer of 'System-on-Chip' application specific standard products (ASSPs) for wire-line and wire-less access solutions worldwide. This includes chipsets for ADSL (DynaMiTeTM), ISDN, POTS and DECT. This new Bluetooth development strengthens Alcatel's position in the wireless segment.
TTPCom has a comprehensive range of products for various communication technologies such as GSM, DAB and Hiperlan. Bluetooth adds to this a short-range wireless interconnection technology. TTPCom licenses a full version 1.0 compliant base-band and protocol stack, application layers as well as a reference design for handset accessories.
Chris Cytera, Sales Manager at TTPCom commented: "We are delighted to be working with Alcatel, a major world-wide supplier of communication ASSPs. Their experience with RF design for GSM and DECT, as well as their 'System-on-Chip' development expertise, is a perfect complement to our software and base-band know how."
"We have selected TTPCom as a well established supplier of wireless communications software and solutions", said Steve Beckers, Business Unit Director, RF Products at Alcatel Microelectronics. "Their track record is impressive and their Bluetooth software and base-band design will enable us a fast and competitive 'time-to-market'."
About TTPCommunications
TTPCom is an independent supplier of technology for digital wireless communications, and was the first such supplier to achieve Full Type Approval for a GSM terminal. It has partnerships with leading companies such as Analog Devices and Hitachi, and has more than 25 type-approved products using its technology including phones from Maxon, Acer, Samsung and Panasonic. For more information, visit the website at: www.ttpcom.com
About Alcatel
Alcatel builds next generation networks, delivering integrated end-to-end voice and data communications solutions to established and new carriers, as well as enterprises and consumers worldwide. With 120,000 employees and sales of EURO 21.3 billion ($25.0 billion), Alcatel operates in more than 130 countries. For more information, visit Alcatel on Internet: www.alcatel.com.
Alcatel Microelectronics is the semiconductor company of Alcatel and develops, manufactures and markets standard and custom application specific semiconductor components for communication applications worldwide. For more information, visit the website at: www.alcatel.com/telecom/micro
Contact
Alcatel Microelectronics
Mirella Kimpen
Tel: +32 2 718 18 40
E-mail: mirella.kimpen@mie.alcatel.be
TTP Communications
Chris Cytera
Tel: +44 (0)1763 266266
E-mail: chris.cytera@ttpcom.com
Related Semiconductor IP
- Verification IP for MIPI SoundWire
- 100M/1G/ TSN Endpoint DO-254 IP Core
- Image Signal Processor
- H.265 / HEVC Video Codec
- H.264 / AVC Video Encoder
Related News
- IKOS Systems Delivers Next Generation Emulator to Alcatel <!-- verification -->
- Cypress and Alcatel Team to Provide Gigabit Ethernet Solutions
- SandCraft Licenses Alcatel Technology for High Performance Network Infrastructure Chips
- Alcatel Selects Virtual Silicon for Next Generation Wireless System-on-Chip Designs
Latest News
- Weebit Nano Q1 FY27 Activities Update
- INTERA Launches EAGLE Cognit, Bringing Ultra-Low-Power Near-Memory AI Acceleration to Next-Generation Edge Devices
- AeroTSN-EP in Action: SOC-E Brings Live Aerospace TSN Demonstration to A&D TSN Summit 2026
- Agnisys and Axiomise Collaborate to Accelerate NoC Design and Formal Sign-off
- TSMC Reports Third Quarter EPS of NT$29.43