TSMC signs up Apple for three-year FinFET deal
Peter Clarke, EETimes
6/24/2013 6:48 AM EDT
TSMC's IC design service partner Global UniChip, which works with customers to help prepare chips for the foundry, is also involved in the three-year deal, Digitimes report said.
To read the full article, click here
Related Semiconductor IP
- Ultra-Low Latency 32Gbps SerDes IP in TSMC 12nm FFC
- Ultra-Low Latency 32Gbps SerDes IP in TSMC 22nm ULP
- 32Gbps SerDes IP in TSMC 12nm FFC
- 32Gbps SerDes IP in TSMC 22nm ULP
- MIPI D-PHY and FPD-Link (LVDS) Combinational Transmitter for TSMC 22nm ULP
Related News
- Intel to Cut A Deal with Apple for Fab 42?
- Qualcomm Booking $4.5B in Apple Deal
- Apple announces multibillion-dollar deal with Broadcom for components made in the USA
- TSMC’s $100 Billion Investment in U.S. Shores Up Top Foundry
Latest News
- JEDEC Advances DDR5 MRDIMM Ecosystem with New Memory Interface Logic and Expanded MRDIMM Roadmap
- Altera Brings Determinism to Physical AI Systems with Latest Release of FPGA AI Suite
- Mosaic SoC raises $3.8M to bring real-time spatial intelligence to every consumer device
- UMC Reports First Quarter 2026 Results
- Rambus Appoints Sumeet Gagneja as Chief Financial Officer