TSMC’s $100 Billion Investment in U.S. Shores Up Top Foundry
By Alan Patterson, EETimes - March 5, 2025
The expansion would build three new chip fabs, two advanced-packaging facilities and an R&D center near Phoenix, Arizona, making the project the largest single foreign direct investment in U.S. history, TSMC said. The company did not provide a timeframe or process technology roadmap for the new investment.
To read the full article, click here
Related Semiconductor IP
- 12-bit, 400 MSPS SAR ADC - TSMC 12nm FFC
- 3.3V Capable GPIO on TSMC 28nm RF HPC+
- 1.2V Thin Oxide GPIO on TSMC 28nm RF HPC+
- LDO Voltage Regulator, 250 mA, TSMC N3P
- LDO Voltage Regulator, Adjustable 0.45 V to 0.9 V Output, 30 mA, TSMC N3P
Related News
- U.S. to Hold Over 20% of Advanced Semiconductor Capacity by 2030, TSMC Expands Investment to US$165 Billion, Says TrendForce
- TSMC Boosts 2026 Expansion Budget, Adds $100B to U.S. Investment
- Biden-Harris Administration Announces Preliminary Terms with Intel to Support Investment in U.S. Semiconductor Technology Leadership and Create Tens of Thousands of Jobs
- TSMC Intends to Expand Its Investment in the United States to US$165 Billion to Power the Future of AI
Latest News
- Arteris Deployed by Speedata for Data Center Compute
- Siemens to acquire Defacto Technologies to complement its EDA portfolio with automated SoC design creation
- Mach42 Completes £7M Funding Round, Led by IP Group With Investment From BGF and Foresight Group
- ELECTRA IC Unveils Comprehensive IP Core Suite for Next-Generation Post-Quantum Cryptography
- CAST Enhances Serial Memory Controller IP with Encryption, Low-Power, and ASIL-Ready Options