TSMC considers German fab
By David Manners, Electronics Weekly (July 26, 2021)
TSMC is looking at building a fab in Germany.
“We are currently doing reviews on Germany seriously, but it’s still in very early stages,” TSMC chairman Mark Liu told shareholders earlier today, “we continue to communicate with our major clients in Germany to see whether this is most important and effective for our clients.”
Liu added that “it’s too early to say” whether or not it will happen.
To read the full article, click here
Related Semiconductor IP
- Ultra-Low Latency 32Gbps SerDes IP in TSMC 12nm FFC
- Ultra-Low Latency 32Gbps SerDes IP in TSMC 22nm ULP
- 32Gbps SerDes IP in TSMC 12nm FFC
- 32Gbps SerDes IP in TSMC 22nm ULP
- MIPI D-PHY and FPD-Link (LVDS) Combinational Transmitter for TSMC 22nm ULP
Related News
- Intel German fab in doubt
- ESMC Breaks Ground on Dresden Fab
- TSMC 6-inch Wafer Fab Exit Affirms Strategy Shift
- TSMC could partner with Bosch for 28nm fab in Germany
Latest News
- SkyeChip Berhad Delivers 35.0% Net Profit Growth Ahead of Main Market Debut on 20 May 2026
- Quantum eMotion and JMEM TEK Sign Consortium Agreement to Accelerate Quantum-Resilient Semiconductor SoC Development
- Silvaco Announces Immediate Availability of Mixel MIPI C-PHY/D-PHY Combo IP on TSMC N2P Process
- BrainChip Strikes IP Licensing Deal with ASICLAND
- Arteris Technology Adopted by Li Auto for Intelligent Vehicles