Seeing Machines Might Be the Next Arm
By Colin Barnden, Semicast Research
EETimes (January 17, 2022)
With CES 2022 finally over, let’s sidestep entirely the feelings of déjà vu surrounding “consumer AVs,” and “personal AVs.” In this article, I focus on details for driver monitoring systems (DMS) and announcements related to Seeing Machines, which is beginning to look a lot like the next Arm.
Far away from the smoke and mirrors of the Las Vegas Strip was a technical white paper published by Ojo-Yoshida Report (that’s EE Times’ old friends Bolaji Ojo and Junko Yoshida) entitled “The DMS Embedding Challenge” written by Seeing Machines. In it the authors describe how industry-standard CPUs and SoCs are typically poorly matched to the specialist processing and pipeline structure necessary for efficient DMS processing.
To read the full article, click here
Related Semiconductor IP
- Secure Boot Loader
- Memory Subsystem
- 4/8-bit mixed-precision NPU IP
- Compiler-centric single-core LPU
- SMC 2nm 1V8 ESD Power Clamp – Low Leakage
Related News
- Finding Talent to Run New Fabs Might Be Challenging
- Strict Restrictions Imposed by US CHIPS Act Will Lower Willingness of Multinational Suppliers to Invest; Chinese Semiconductor Development Will Be Limited for Next Decade, Says TrendForce
- Chevin are proud to be awarded runner-up of Arm Silicon Startups Contest 2025
- VIA NEXT Joins Arm Total Design Ecosystem to Accelerate Next-Generation AI and HPC Innovations
Latest News
- Openchip unveils BER10: Europe’s new sovereign chip is here
- SEMIFIVE Accelerates Growth with 97% YoY Revenue Surge in H1 2026, Powered by ASIC Turnkey, Mass Production, and IP
- Andes Technology has shut down Condor Computing
- TIER IV joins JST’s Next-Generation Edge AI Semiconductor R&D Program to open-source AI chip designs for autonomous driving
- BrainChip Partners With Orama.AOI For AI-Fueled Defect Detection