Samsung's 14 nm LPE FinFET Transistors
Kevin Gibb, Product Line Manager, TechInsights
EETimes (1/19/2016 10:40 AM EST)
As Samsung prepares to launch its 14 nm Low Power Plus (LPP) process used in the Exynos 8 SoC, TechInsights anticipates what changes we should expect.
Samsung’s Exynos 8 SoC is receiving some press buzz as the company prepares to launch its 14 nm Low Power Plus (LPP) process that is an update to its current Low Power Early (LPE) process used in its Exynos 7 SoC and the Apple A9 SoC.
There are now three foundries capable of making finFET transistors: Intel, Samsung and TSMC. We at TechInsights last looked at Samsung’s 14 nm low power early (LPE) finFET process used in Exynos 7420 SoC in May of 2015 (Samsung Galaxy S6 Edge Smartphone). We were a little coy in our discussions of the process technology used to make the transistors; our business after all is to sell reports describing just this.
It is almost a year on now and there is talk of Samsung’s updated 14 nm LPP finFET process. We won’t know the details of this process until we get our hands on some samples of either Samsung’s Exynos 8890 SoC, or Qualcomm’s Snapdragon 820 SoC later this spring, but we can reveal more of the 14 nm LPE process technology used in the Exynos 7420.
To read the full article, click here
Related Semiconductor IP
- DC-DC Split-Pi Boost-Buck Converter
- Deep learning accelerator
- MIL-STD-1553 Controller IP
- UFS 5.x Device IP
- UCIe 3.x Controller IP
Related News
- Altera to Build Next-Generation, High-Performance FPGAs on Intel's 14 nm Tri-Gate Technology
- Altera Achieves Industry Milestone: Demonstrates FPGA Technology Based on Intel 14 nm Tri-Gate Process
- Altera Enables Customer Design Starts for 14 nm Stratix 10 FPGAs and SoCs
- TechInsights - The much anticipated Intel 14 nm is finally here!
Latest News
- Infineon opens the world's largest fab for power semiconductors and analog/mixed-signal technologies in Dresden
- Tenstorrent Sets New Performance Records, Launches TT- Ascalon S, and Expands Across Japan
- Chips&Media Signs APV codec IP Licensing Deal with North American Big Tech, Establishing the ‘Second Front’ Against Apple’s ProRes
- Chipsolve Technologies Appoints Balaji Kanigicherla as Chairman of the Board
- OXMIQ Raises $35 Million to Scale OxCore™ Architecture