Samsung Completes Qualification of its 2nd Generation 10nm Process Technology
Samsung expands 10nm capacity, to be ready for production by the fourth quarter of this year
San Jose, USA – April 19, 2017 – Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, announced today that its second generation 10-nanometer (nm) FinFET process technology, 10LPP (Low Power Plus), has been qualified and is ready for production. With further enhancement in 3D FinFET structure, 10LPP allows up to 10-percent higher performance or 15-percent lower power consumption compared to the first generation 10LPE (Low-Power Early) process with the same area scaling.
Samsung was the first in the industry to begin mass production of system-on-chips (SoCs) products on 10LPE last October. The latest Samsung Galaxy S8 smartphones are powered by some of these SoCs.
To meet long-term demand for the 10nm process for a wide range of customers, Samsung has started installing production equipment at its newest S3-line in Hwaseong, Korea. The S3-line is expected to be ready for production by the fourth quarter of this year.
“With our successful 10LPE production experience, we have commenced production of the 10LPP to maintain our leadership in the advanced-node foundry market,” said Ryan Lee, Vice President of Foundry Marketing at Samsung Electronics. “10LPP will be one of our key process offerings for high performance mobile, computing and network applications, and Samsung will continue to offer the most advanced logic process technology.”
Related Semiconductor IP
- AP Memory VHM Controller
- High-performance, commercial-grade RISC-V CPU Core IP
- SWI3S Verification IP
- Secure Boot Loader
- Memory Subsystem
Related News
- Synopsys' Custom Compiler Certified for TSMC 10-nm and 7-nm FinFET Process Nodes
- Silicon Creations Taps Silvaco's Custom Design Flow for 10nm FinFET Designs
- eMemory's NeoFuse IP Verified in TSMC 10nm FinFET Process
- Samsung Electronics on Track for 10nm FinFET Process Technology Production Ramp-up
Latest News
- proteanTecs Unveils Advanced Packaging Solutions to Improve Yield, Performance, and Reliability of Multi-Die Systems
- StarFive Launches Server-Class RISC-V IP to Accelerate Its Strategic Expansion into AI Computing Infrastructure
- Silvaco Announces Partnership with Dassault Systèmes to Advance First-Time-Right Semiconductor Manufacturing
- Socionext Broadens SoC Roadmap with Intel 18A-P Process Technology
- BrainChip and Neuromorphyx Announce an AKD1500 Embedded Developer Board, Bringing Neuromorphic AI to the Embedded Engineering Community