RISC-V Silicon in the Jungle Could Save the Amazon
Researchers at the University of São Paulo use RISC-V to build the Internet of Trees, a real-time monitoring network for the Amazon rainforest.
By Pablo Valerio, EE Times | June 16, 2026

The Amazon basin faces a major challenge: Its tropical forests are the world’s largest land-based carbon sink and play a key role in regulating the global climate, yet scientists lack reliable, real-time data to monitor their health.
At the RISC-V Summit Europe 2026, two Brazilian researchers introduced the “Internet of Trees,” a system that uses open-architecture microprocessors to create a connected network acting as a digital nervous system for the forest.
Led by professors Marcelo Zuffo and Laisa Costa of the University of São Paulo, the project aims to deploy microsensors throughout the rainforest to continuously monitor the Amazon’s biodiversity.
To read the full article, click here
Related Semiconductor IP
- RISC-V Display Connectivity Subsystem (DCS)
- RISC-V IOPMP IP
- RISC-V Debug & Trace IP
- Gen#2 of 64-bit RISC-V core with out-of-order pipeline based complex
- 64-bit RISC-V core with in-order single issue pipeline. Tiny Linux-capable processor for IoT applications.
Related News
- Chinese RISC-V Chipmaker SpacemiT Launches K3 AI CPU, Highlighting the Rise of Open-Source Hardware in Intelligent Computing
- Quintauris Announces Strategic Collaboration with MIPS to enable MIPS Atlas as part of RT-Europa
- BrainChip Announces $25 Million (USD) Funding Ahead of CES to Power Next-Gen Edge AI
- Arteris to Expand Portfolio with Acquisition of Cycuity, a Leader in Semiconductor Cybersecurity Assurance
Latest News
- Quintauris and Nuclei Cooperate to Ensure Automotive Real-Time RISC-V Readiness with RT-Europa
- RISC-V Silicon in the Jungle Could Save the Amazon
- Xiphera contributes to SecureSoC, strengthening Finland’s cybersecurity, security of supply, and semiconductor expertise
- CEA-Leti Scales Ferroelectric RAM to 22nm Node, Unlocking Denser, More Efficient Memory for Edge AI
- ASML, TSMC and imec bring industry-ready 2D-material transistors closer with breakthrough 300mm integration