Startup Taps TSMC to Attack Broadcom
Rick Merritt
3/6/2017 02:25 PM EST
Mediatek takes InFO package to data center
SAN JOSE, Calif. — One of a handful of startups aiming to attack Broadcom’s dominance in Ethernet switching emerges from stealth mode this week. Nephos spun out of Taiwan’s Mediatek and will push packaging technology from TSMC to a new level.
Broadcom held a whopping 94.5% share of the $687 million market for merchant 10–40-Gbit/second Ethernet switch chips in 2015, according to Linley Group analyst Bob Wheeler. Nephos is the latest of three startups to emerge seeking a slice of that pie and one most likely to provide a mainstream alternative, he said.
To read the full article, click here
Related Semiconductor IP
- I2C Master/Slave Controller Core
- NVMe Validation Test Suite
- Hybrid Memory Cube Verification IP
- nQrux® Root of Trust IP
- AXI to UCIe Bridge IP
Related News
- Broadcom Files Suit Asserting Qualcomm's Licensing Practices Violate U.S. Law
- Broadcom Chooses ARM Cortex-R4 Processor For Next-Generation Blu-Ray Players
- Broadcom Licenses Cryptography Research's CryptoFirewall, Boosting Tamper Resistance and Security
- Broadcom Announces Industry's First 65nm All-DSP, Dual PHY Solutions for 10GbE SFP+ Applications
Latest News
- TSMC September 2026 Revenue Report
- Lattice Collaborates with Arm to Advance Secure, Adaptable AI Data Center Infrastructure
- ZLG Selects CAST CAN XL and TSN IP for Next-Generation Vehicle-Network Development and Test Tools
- Vayavya Labs and Tenstorrent Partner to Accelerate RISC-V Hardware and Software Development Through Virtual Platform Modeling
- RaiderChip’s Edge NPU reaches more than 50 Generative AI Models with the addition of Qwen3.8-27B