China readies first multicore Godson CPUs
Dylan McGrath, EE Times
(08/27/2008 12:10 PM EDT)
Palo Alto, Calif.— Chinese researchers are preparing the first multicore versions of Godson, the country's first homegrown microprocessor, with four- and eight-core designs scheduled to tape out in the coming months. China hopes to build a petaflops high-performance computer based on the Godson-3 in 2010.
The four-core version of the Godson-3 is scheduled to tape out before the end of the year, and tape out of the eight-core version is planned for 2009, according to Zhiwei Xu, deputy directory of the Chinese Academy of Sciences' Institute of Computing Technology, who presented a paper on the Godson-3 architecture at the Hot Chips conference here Tuesday (Aug. 26).
(08/27/2008 12:10 PM EDT)
Palo Alto, Calif.— Chinese researchers are preparing the first multicore versions of Godson, the country's first homegrown microprocessor, with four- and eight-core designs scheduled to tape out in the coming months. China hopes to build a petaflops high-performance computer based on the Godson-3 in 2010.
The four-core version of the Godson-3 is scheduled to tape out before the end of the year, and tape out of the eight-core version is planned for 2009, according to Zhiwei Xu, deputy directory of the Chinese Academy of Sciences' Institute of Computing Technology, who presented a paper on the Godson-3 architecture at the Hot Chips conference here Tuesday (Aug. 26).
To read the full article, click here
Related Semiconductor IP
- NPU IP
- JPEG XL Encoder
- I2C Master/Slave Controller Core
- NVMe Validation Test Suite
- Hybrid Memory Cube Verification IP
Related News
- Distributed In-Chip Thermal Sensors Improve Multicore CPU Monitoring
- Join Andes at RISC-V Summit; Learn the Only ISO 26262 Fully-Compliant RISC-V CPU, the Latest Multicore 4-Way Out-Of-Order Processor & the Multicore 1024-bit Vector Processor
- Socionext Announces Collaboration with Arm and TSMC on 2nm Multi-Core Leading CPU Chiplet Development
- China follows Godson processors with DSP
Latest News
- Cadence Wins Five 2026 TSMC OIP Partner of the Year Awards
- Lattice Delivers Industry-First PQC-Enabled Platform Firmware Resilience for AI Infrastructure with Lattice Sentry Solution Stack
- AI agents are changing what CPU performance means
- intoPIX to Demonstrate JPEG XS, IPMX and SMPTE ST 2110 Solutions at NAB Show New York 2026
- GF unveils roadmap to deliver the world’s most advanced FD-SOI platform for Physical AI